美东时间1月28日，特斯拉2025年第四季度财报电话会议上，CEO埃隆·马斯克将核心议题锁定 芯片自主化，明确芯片（尤其内存芯片）是未来增长的核心 瓶颈，官宣兆级晶圆厂（TerraFab）建设、自研AI5/AI6芯片等重磅规划 ，同步披露2026年大额资本支出与配套产能布局，彰显其摆脱供应链束缚、支撑 AI与机器人业务的战略决心。 亮眼财报为芯片战略提供坚实支撑：特斯拉Q4营收249亿美元、调整后EPS 0.50美元，均超市场预期；汽车业务毛利率升至17.9%，现金及投资超440亿美 元，充足的资金储备成为芯片自主化与产能扩张的重要保障，也印证了其加大核心领域投入的可行性。 马斯克在会议中直言，随着Cybercab自动驾驶出租车（4月量产）、Optimus人形机器人（目标年产能100万台）推进，特斯拉对AI芯片、内存芯片的需求 呈爆发式增长，仅Optimus年产能达100万台时，年芯片需求就将达60亿美元。而当前全球高端芯片（含内存芯片）产能高度依赖台积电、三星、美光等外 部厂商，不仅存在产能分配优先级不足的问题，更面临地缘政治引发的供应链中断风险，现有供应链已无法匹配其长期发展目标，内存芯片的供应短缺更 是 ...

近日，昂瑞微披露2025年年度业绩预告，预计亏损超1亿元，且亏损幅度较上年进一步扩大。 一时间，"行业寒冬"、"经营承压"的议论此起彼伏。我们拨开亏损数字的表象， 尝试 深入剖析业绩背后的逻辑便会发现，这份成绩单的背后，彰显出公 司在行业低谷期难得的战略定力。 | 亏损背后 当前，射频芯片行业确实面临阶段性压力。消费电子市场需求疲软，手机出货量下滑带动库存去化，上游芯片企业普遍面临经营挑战，即便行业龙头亦未 能幸免，这是整个射频芯片领域共同遭遇的行业性难题。 公告中明确： 昂瑞微积极应对，策略上颇具差异化。它并未选择在竞争激烈的红海市场中参与价格内卷，争夺持续萎缩的市场份额，而是做出了一项审 慎且具前瞻性的决策：主动剥离一批盈利能力弱、发展潜力有限的低毛利项目。 这如同企业在行业淡季的战略"瘦身"，摒弃非核心业务的资源消耗，将有限的资金与研发力量，集中投向核心竞争力强、符合未来发展趋势的重点业务， 为后续的高质量发展轻装上阵。 因此，本次亏损的部分成因，是公司主动清理低效业务、优化资源配置的结果，本质上是为长期发展夯实基础。 | 核心底气 在多数企业受消费电子市场波动影响而焦虑之际，昂瑞微凭借多元化的业务布局 ...

Price Increases in Semiconductor and Electronic Components Industry - Resonac announced a price increase of 30% for copper-clad laminates and adhesive films starting March 1, 2026, due to tight supply and rising costs of raw materials and labor [3] - Nanya Plastics will raise prices for all CCL products and PP by 8% starting November 20, 2025, citing increases in international copper prices and raw material costs [7] - TrendForce predicts that the average capacity utilization rate of global 8-inch wafer foundries will rise to 85%-90% in 2026, leading to price increases of 5%-20% for wafer foundry services across the board [8] - TSMC plans to increase prices for advanced technology nodes (5nm, 4nm, 3nm, 2nm) by 8%-10%, with a 50% increase for 2nm wafers starting in 2026 [10] - SMIC has implemented a price increase of approximately 10% for certain capacities [11] - Several packaging and testing companies have begun raising prices, with increases nearing 30% due to high demand and full capacity utilization [13] Memory Chip Price Increases - Samsung has raised NAND flash prices by over 100% and plans to increase server DRAM prices by 60%-70% in Q1 2026 [15] - SK Hynix is also raising server DRAM prices by 60%-70% and has negotiated significant price increases for LPDDR memory used in iPhones, approaching 100% [16] - Micron has announced a general price increase of approximately 20% across its product lines [17] - NAND flash wafer prices increased by over 10% in December 2025, with SSD prices rising by 15%-20% [24] Passive Components Price Adjustments - Various passive component manufacturers, including Yageo and Panasonic, have announced price increases for capacitors and resistors ranging from 8% to 30% [26][31] - ROHM Semiconductor has raised prices for thick film resistors by 8%-20% [38] - Multiple manufacturers are adjusting prices due to rising raw material costs and supply chain pressures [47] Power Devices and Other Electronics - Huazhong Microelectronics confirmed price increases for certain IGBT products due to rising copper and raw material costs [48] - Several semiconductor companies, including Jiangxi Tianyi and Wuxi Zongxiang Technology, have raised prices for specific products by 10%-20% [82][83] CPU and GPU Price Trends - AMD and Intel are planning to increase server CPU prices by up to 15% due to high demand from large enterprises [62] - NVIDIA and AMD are expected to raise GPU prices in early 2026, with multiple price adjustments anticipated throughout the year [79]

今日，阿里巴巴集团全资半导体业务主体平头哥，于官网正式发布高端AI训推一体芯片真武810E。与此同时，阿里全栈AI战略阵型"通云哥"首度揭开神 秘面纱，而这款真武810E，正是此前被央视《新闻联播》报道过的阿里自研PPU芯片，标志着阿里在AI芯片领域的布局迎来关键落地。 针对具体应用场景，真武810E覆盖四大核心领域，展现出广泛的适配能力。在自动驾驶领域，芯片已兼容超过50个自动驾驶常见模型，全面支持感知、 预测、端到端等多种模型架构的训推需求，且已实现万卡级别集群部署；在AI训练领域，原生支持多类框架，依托高速片间互联技术实现优异的集群线 性加速比，为用户提供高性能、高易用的训练算力；在AI推理领域，兼容主流推理引擎，搭配自研专用推理框架与算子库及大容量内存，实现大模型推 理针对性优化；在多模态模型领域，该芯片在文生视频、图文生视频、图文生文等场景的训推实测中表现突出，为多模态应用提供高性价比算力支撑。 从2009年创建阿里云，到2018年成立平头哥布局芯片，再到2019年启动大模型研究，阿里巴巴历经17年的战略投入与垂直整合，最终完成"通云哥"全栈AI 生态的完整布局。据平头哥官网介绍，公司核心定位为AI ...

Core Viewpoint - The investment by Haowei Group in Aixin Yuanzhi Semiconductor is a strategic move to enhance collaboration in AI chips and smart automotive sectors, highlighting the importance of their relationship and potential synergies [1][3]. Investment Details - Haowei Group's wholly-owned subsidiary, Weier Semiconductor Hong Kong, plans to invest up to $50 million in Aixin Yuanzhi's IPO on the Hong Kong Stock Exchange [1]. - The investment aims to deepen strategic collaboration, leveraging Aixin Yuanzhi's core technologies in visual terminals, edge inference, and smart automotive fields [3]. - The shareholding ratio will be determined based on Aixin Yuanzhi's market value at the time of issuance, with the investment amount excluding various transaction fees [3]. Strategic Collaboration - The core purpose of the investment is to promote deep strategic cooperation in key areas such as automotive intelligent driving and edge AI [3]. - Aixin Yuanzhi is recognized as a leading supplier in the AI inference system chip sector, focusing on high-performance platforms for edge computing and terminal AI applications [4]. - Aixin Yuanzhi has developed five generations of SoC products and ranks first in global shipments of mid-to-high-end visual edge AI inference chips, indicating strong market competitiveness [4]. Financial Implications - The transaction will be classified as a financial investment in Haowei Group's financial statements, measured at fair value with changes recorded in current profits and losses [7]. - The investment is expected to enhance capital efficiency without significantly impacting the company's daily operations or performance [7]. - The pricing of the transaction adheres to market fairness principles, ensuring no harm to the interests of the company or minority shareholders [7]. Future Outlook - This investment is a significant step for Haowei Group in the semiconductor industry, aiming to capture opportunities in the rapidly growing fields of AI and smart automotive [8]. - The ongoing IPO process of Aixin Yuanzhi and the implementation of their collaborative efforts will be closely monitored by the industry [8].

2026年1月28日，光刻机巨头ASML同步披露两项关键动态：一是 2025年第四季度及全年财报创下历史新高 ，二是 宣布裁员1700人（占员工 总数3.8%） ，这也是其自2010年开启长期扩张以来规模最大的一次裁员。在AI驱动半导体行业持续高景气的背景下，这份"业绩飘红+大规模 裁员"的反差组合，迅速引发市场广泛关注。 这一裁员决定已引发内部波动，多位伴随公司成长的资深被裁员工表达了震惊与寒心，相关情绪也蔓延至在职员工群体，引发对职业稳定性的 担忧。值得注意的是，ASML的裁员并非业务收缩信号，反而呈现"减员与增聘并行"的特点——在剥离管理岗冗余的同时，公司计划在制造、 客户支持等核心业务领域补充人员，还规划建设新园区，以应对持续增长的市场需求。猜测这种操作的核心是优化人员结构，将资源集中投向 直接创造价值的核心业务环节。 ASML的业绩增长，核心得益于AI浪潮带来的需求红利 。公司明确表示，全球科技巨头加码数据中心建设，直接推动先进制程芯片产能扩 张，逻辑芯片和存储芯片客户均在加速产能规划，为光刻机需求提供了强劲支撑。巴克莱证券预测，仅SK海力士一家，2026年就将采购12台 EUV光刻机，为ASML贡 ...

1月28日消息，光刻机巨头ASML宣布将裁员1700人，占员工总数的3.8%！ 这次裁员是ASML在2010年长期扩张后最大的一次裁员。 据ASML最新财报显示，公司2025年第四季度订单远超超市场预期。财报显示，第四季度订单额达132 亿欧元，其中EUV订单74亿欧元，订单积压规模达388亿欧元。此外，第四季度净销售额达97亿欧元创 纪录新高，其中包含两台High NA系统的收入确认。公司2025年全年净销售额达327亿欧元，净利润96 亿欧元，均创历史新高。 值得注意的是，2025年第四季度ASML新售出的光刻系统为94台，二手光刻系统为8台，全年新光刻系 统为300台，二手光刻系统为27台。相比于2024年380台新光刻系统，38台二手光刻系统，出现了下滑。 是说芯语原创，欢迎关注分享 合作洽谈，进入公众号：服务—>商务合作 阿斯麦首席执行官Christophe Fouquet表示，客户近月来对中期市场形势的评估明显转向积极，主要基于 对AI相关需求可持续性的更强预期。2026 年将是阿斯麦公司的又一个增长之年。 ASML首席财务官罗杰表示，公司收到反馈，指出其组织架构过于复杂，导致员工在流程协调上耗费 ...

2026年1月27日，国内低功耗无线物联网芯片领军企业泰凌微正式披露公告，拟通过发行股份及支付现金相结合的方式，作价8.50亿元收购同行企业磐启 微100%股权，并同步募集配套资金。交易完成后，磐启微将成为泰凌微全资子公司，此交易不构成重大资产重组的产业并购。 此次被收购的磐启微成立于2011年，2025年获评国家级专精特新"小巨人"企业，在短距无线通讯芯片领域拥有差异化技术优势。其核心产品聚焦BLE和 2.4G私有协议，其中BLE产品采用成熟工艺即可实现国际主流先进工艺产品的同等甚至更低功耗，2.4G私有协议产品则在同等性能下将芯片面积缩减30% 至40%以上，具备显著成本优势。磐启微的产品主要切入遥控玩具、智能表计、扫码枪等细分领域，与泰凌微的客户群体和市场布局形成高度互补，为双 方协同发展提供了广阔空间。 在全球低功耗无线物联网芯片市场，国际头部厂商凭借先发优势和综合实力占据主导地位，国内企业虽近年加速崛起，但在营收规模、产品生态、IP储备 等方面仍存在差距。泰凌微自2010年成立以来，深耕短距无线通讯芯片领域，凭借技术积累跻身全球第一梯队，作为全球蓝牙技术联盟董事会中唯一的中 国企业，其BLE、Zig ...

Core Viewpoint - The company, Aisen Co., has announced the establishment of a wholly-owned subsidiary in Nantong Economic and Technological Development Zone to invest in a semiconductor materials manufacturing base, with a total investment of 2 billion yuan [1]. Group 1: Project Overview - The project will cover an area of approximately 159 acres and aims to build a production line with an annual output of 23,000 tons of semiconductor materials [1]. - The project will be implemented in two phases, with the first phase expected to commence production in 2028 and the second phase in 2030, reaching full production by 2035 [1][3]. - The planned products include key materials such as photoresists, plating solutions, and high-purity reagents, which will significantly enhance the company's production capacity and market position [1][4]. Group 2: Market Position and Financial Performance - Aisen Co. anticipates achieving an operating income of approximately 594 million yuan in 2025, representing a year-on-year growth of 37.54%, and a net profit attributable to shareholders of about 50.46 million yuan, up 50.74% year-on-year [4]. - The company is benefiting from the recovery of the semiconductor industry driven by emerging technologies such as 5G, AI, and IoT, leading to increased demand for chips [4]. - The company has established itself as a leader in the production of advanced packaging photoresists and plating solutions, entering the supply chains of major clients like Longji Technology and BOE [6]. Group 3: Strategic Advantages - The establishment of the Nantong manufacturing base will create synergies with the subsidiary's existing projects, enhancing the supply chain stability and reducing procurement costs [6]. - The integration of upstream and downstream operations will facilitate rapid technological iterations and improve customer attraction through one-stop material solutions [6].

1月27日晚间，国产GPU龙头企业沐曦股份（688802）披露2025年年度业绩预告。公告显示，公司2025 年营收实现大幅增长，同时亏损幅度较上年同期显著收窄，经营状况持续改善。 业绩预告显示，沐曦股份2025年度预计实现营业收入16亿元至17亿元，较上年同期增长115.32%至 128.78%，营收增长势头强劲。尽管公司全年经营仍处于亏损状态，但亏损收窄成效显著。其中，预计 归属于母公司所有者的净利润亏损6.50亿元至7.98亿元，较上年同期14.09亿元的净亏损，收窄幅度达 43.36%至53.86%；扣除非经常性损益后的净利润预计亏损7.00亿元至8.35亿元，较上年同期10.44亿元的 扣非净亏损，收窄幅度为20.01%至32.94%。 市场表现方面，截至当日上午收盘，沐曦股份股价报576.39元/股，对应市值达2306亿元，展现出资本 市场对公司业绩改善的积极反馈。 | 沐曦股份-U[688802]A股实时行情 - 百度股市通 | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 576.39元 +4.21 +0.7 ...