证券日报网讯 华天科技（002185）8月29日在互动平台回答投资者提问时表示，公司CPO封装技术关键 单元工艺开发正在进行之中。 ...

Group 1 - The advanced packaging industry is at a turning point, with technology nearing a replacement threshold, and the high-end market share expected to quadruple in five years, potentially reaching a market size of $91.1 billion by 2030 [1] - Companies are strategically positioning themselves in the high-end segment of the advanced packaging market [1] Group 2 - A hidden champion in automotive electronics has been identified, along with a new player in humanoid robot sensors, both deeply integrated with BYD and several Tier 1 manufacturers [1] - The actuator business has shown a continuous growth rate exceeding 30% for three consecutive years, while the humanoid robot six-dimensional force sensor market has been initiated, with profits expected to reach $320 million by 2027 [1]

Group 1 - ASE Technology Holding Co Ltd is rated a buy due to its aggressive growth prospects and potential for high profitability within 1-2 years [1] - The investment philosophy of the analyst emphasizes long-term discipline and consistent alpha generation, indicating a focus on sustainable growth [1] - The article reflects the author's personal opinions and does not involve any compensation from the companies mentioned, ensuring an unbiased perspective [1]

气派科技8月4日晚间公告，董事会会议同意选举梁大钟为公司第五届董事会董事长，同意聘任梁大钟担 任公司总经理，聘任饶锡林、文正国、王羊宝担任公司副总经理，聘任文正国为董事会秘书，聘任李泽 伟为财务总监，任期与本届董事会任期一致。 ...

Financial Performance - Q2 2025 revenue reached $1.51 billion, a 14% sequential increase[11] - Q2 2025 Earnings Per Share (EPS) was $0.22[11] - Q2 2025 Gross Profit was $182 million, representing a gross margin of 12%[28] - Q2 2025 Operating Income was $92 million, with an operating margin of 6.1%[24] - Q2 2025 EBITDA was $259 million, resulting in an EBITDA margin of 17.1%[38] - The company's cash and short-term investments totaled $2.0 billion[38] - The company's liquidity was $3.1 billion[38] - Total debt stood at $1.6 billion, with a debt to EBITDA ratio of 1.5x[38] Future Outlook - Q3 2025 revenue is projected to be between $1.875 billion and $1.975 billion[41, 46] - Q3 2025 gross margin is expected to be in the range of 13.0% to 14.5%[41] - 2025 Capital Expenditures (CapEx) are estimated at $850 million[41] End Market Dynamics - All end markets achieved double-digit sequential growth in Q2 2025[11]

Financial Data and Key Metrics Changes - The group achieved revenue of approximately US$837.6 million for the first half of 2025, with a year-on-year growth of 31.7% and a half-on-half growth of 6.1% [17] - The group's gross margin was 40.3%, up 121 basis points half-on-half but down 65 basis points year-on-year [18] - Adjusted net profit reached HKD218.1 million, up 95.7% half-on-half, but down 12.2% year-on-year [19][20] - For Q2 2025, revenue totaled approximately US$436.1 million, an increase of 8.9% quarter-on-quarter and 1.8% year-on-year [22] Business Line Data and Key Metrics Changes - Advanced Packaging (AP) revenue contributed around 39% of the group's total revenue, approximately US$326 million, driven by strong demand for thermal compression bonding (TCB) tools [8][9] - Semiconductor Solutions segment revenue grew to US$257.6 million in Q2 2025, up 1% quarter-on-quarter and 20.9% year-on-year [25] - SMT Solutions segment delivered revenue of US$178.5 million in Q2 2025, a 22.6% increase quarter-on-quarter but a 17.2% decline year-on-year [28] Market Data and Key Metrics Changes - China accounted for 36.7% of group revenue, with strong growth driven by AI demand [31] - The automotive end market contributed 15% to group revenue, supported by electric vehicle demand in China [30] - The computer end market became the largest contributor to group revenue, accounting for 30%, driven by AI-related applications [21] Company Strategy and Development Direction - The company expects sustained growth in Advanced Packaging, particularly benefiting from AI tailwinds and technological leadership [32] - The group aims to solidify its TCB market leadership in both memory and logic applications, projecting a total addressable market of US$1 billion by 2027 [32] - The mainstream business will be supported by momentum in China and emerging demand for AI data centers, although automotive and industrial markets are expected to remain soft [33] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in continued demand for AI-related applications, particularly in the semiconductor sector [5][6] - The company acknowledged uncertainties related to tariff policies but emphasized its global presence as a means to navigate potential impacts [33] - Management noted that the group has maintained a gross margin above 40% despite foreign exchange headwinds [7] Other Important Information - The group has maintained a diversified customer base, with the top five customers accounting for approximately 24.8% of total revenue in the first half of 2025 [31] - The company has an existing dividend policy of distributing about 50% of annual profits as dividends, with a recommended dividend of HKD0.26 per share for the first half of 2025 [20] Q&A Session Summary Question: Booking trend into the third quarter across different businesses - Management expects Q3 bookings to be slightly down quarter-on-quarter but up double digits year-on-year, with AI-related applications driving demand [38][40] Question: SMT bookings recovery in the second quarter - SMT bookings showed strong recovery due to bulk orders, but future orders may not be as material as those in Q2 [42] Question: Order opportunities for HBM in the next 12-18 months - Management is confident in continued order opportunities for HBM, particularly with the introduction of new AI chips [50][51] Question: Differentiation in hybrid bonding tools - The company believes its second-generation hybrid bonding tools will be competitive, addressing customer pain points effectively [103] Question: Sustainability of tax credits - Management indicated that the tax credits received in Q2 are a one-off and not expected to recur in the near term [82]

Investment Rating - JCET: Buy, Target Price RMB 46.80, implying 39% upside from current share price [4][6][36] - Tongfu: Hold, Target Price RMB 27.30, implying 8% upside from current share price [5][6][58] Core Insights - The revenue growth of China's OSAT companies is expected to slow in 2Q25 due to order shifts to Taiwanese peers and seasonal factors, but is anticipated to accelerate in 3Q25 driven by recovering consumer electronics demand and government subsidies [3][9] - JCET's revenue growth is projected to be 19% year-on-year in 2Q25, slowing from 36% in 1Q25, but expected to rebound to 24% in 3Q25 [4][28] - Tongfu's non-AMD business is expected to grow faster than its AMD business, with a projected 16% increase in 2025 compared to 9% for the AMD segment [5][51] Summary by Sections JCET - JCET's Apple business is gaining attention with potential upside for SiP modules due to design changes for foldable phones [4] - The company plans a historic high capex of RMB 8.5 billion in 2025 to support growth in advanced packaging and automotive sectors [16][36] - Revenue estimates for JCET have been adjusted, with total revenue expected to be RMB 41.285 billion in 2025, reflecting a 2% decrease from previous estimates [32][33] Tongfu - Tongfu's revenue guidance for 2025 is an 11% increase, with adjustments reflecting a 6% decrease in total revenue estimates [5][54] - The acquisition of a 26% stake in King Long Suzhou is expected to contribute RMB 150-200 million in investment gains from 2025 to 2027 [5][49] - Revenue from Tongfu's non-AMD segment is projected to grow at 16% in 2025, benefiting from foreign customers adopting a "China-for-China" strategy [5][51] Financial Metrics - JCET's net profit CAGR for 2025-27 is estimated at 33%, down from 41% previously, with a target price reduction from RMB 50.00 to RMB 46.80 [4][37] - Tongfu's net profit estimates for 2025 and 2026 have been lowered by 16% and 13% respectively, reflecting challenges in the AMD segment [56][58] - JCET's current valuation is attractive compared to its peers, trading at a 21.5x 2026e PE multiple, below the sector average [36][37]

Group 1 - The advanced packaging sector continues to rise, with multiple stocks hitting the daily limit, including Tongxingda (002845), Kangda New Materials (002669), Landi Group (603726), Kuaike Intelligent (603203), and Bomin Electronics (603936) [1]

Summary of ASE's Role in the Next Heterogeneous Revolution Industry Overview - The document discusses the semiconductor packaging industry, specifically focusing on ASE's advancements in heterogeneous integration and photonic packaging technologies, particularly Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) [4][12][18]. Core Points and Arguments 1. **Technological Evolution**: ASE is at the forefront of a significant technological evolution, transitioning from traditional electrical interconnects to photonic solutions, which are essential for meeting the demands of AI computing and high-performance computing (HPC) [4][5][12]. 2. **Heterogeneous Integration Strategy**: ASE's comprehensive strategy includes chiplet-based architectures, advanced fan-out, and 2.5D/3D integration, redefining semiconductor packaging boundaries [11][20]. 3. **Photonic Integration**: ASE emphasizes the critical role of photonic integration in enhancing bandwidth and reducing latency, addressing the limitations of traditional electrical interconnects [12][20][22]. 4. **VIPack™ Platform**: ASE's VIPack™ platform is designed to support advanced packaging technologies, enabling high-density integration and optimized design workflows, which can reduce time-to-market by up to 50% [27][33]. 5. **Market Growth Forecast**: ASE anticipates revenue from advanced packaging and testing to grow from USD $600 million in 2024 to over USD $1.6 billion in 2025, with over 75% of this growth attributed to cutting-edge packaging technologies [29]. Additional Important Content 1. **CPO Development**: ASE is positioning VIPack™ as a foundation for optical-electrical convergence, integrating SiPh and optical engines within a single package, which supports high-bandwidth, low-power applications [28][60]. 2. **System-Level Integration**: The integration of optical interconnects into packaging is seen as a fundamental architectural transformation, enabling better performance for AI accelerators and high-bandwidth memory modules [42][45]. 3. **Challenges in Transition**: The shift to CPO introduces challenges in packaging, interconnect, and testing, necessitating robust supply chain collaboration and new testing protocols [72][93]. 4. **New Value Creation**: The emergence of SiPh and CPO is redefining how chips, packages, and systems interact, creating a new value chain that emphasizes tighter integration across the semiconductor ecosystem [95][100]. Conclusion - ASE is not only responding to the rise of AI but is actively shaping the future of semiconductor packaging through innovative technologies and strategic investments in photonic integration and heterogeneous systems, positioning itself as a key enabler in the evolving landscape of AI and HPC [22][33][101].