Financial Data and Key Metrics Changes - The group delivered a revenue of $1.76 billion for the full year 2025, representing a 10.0% year-on-year increase, driven largely by TCB [15][17] - Group bookings reached $1.86 billion, reflecting a 21.7% year-on-year growth, with a book-to-bill ratio of 1.05, the highest since 2021 [15][17] - Group adjusted gross margin was 38.3%, down 172 basis points year-on-year, while operating expenditures increased by 3.2% year-on-year to HKD 4.56 billion [16][17] Business Line Data and Key Metrics Changes - Advanced Packaging (AP) revenue grew by 30.2% year-on-year, with TCB revenue growth at approximately 146% year-on-year [9][12] - SEMI Solutions segment delivered Q4 revenue of $245.6 million, up 19.5% year-on-year, driven by AI-related applications [19] - SMT Solutions segment reported Q4 revenue of $263.3 million, up 43.8% year-on-year, supported by AI servers and EVs in China [21][22] Market Data and Key Metrics Changes - China remained the largest market, contributing 41% of group revenues, while Europe and Americas saw declines due to soft market conditions [24][25] - The computing end market became the largest contributor to group revenue at 22%, driven by TCB solutions [23][24] - The automotive end market contributed almost 16% to group revenue, supported by EV demand in China [24] Company Strategy and Development Direction - The company is focusing on optimizing its portfolio and streamlining operations to enhance agility and improve margins, particularly in the Back-End Packaging business [27] - The divestment of ASMPT NEXX is part of the strategy to concentrate resources on back-end technologies, which align better with the company's strengths [27][42] - The company anticipates sustained growth driven by AI demand across both SEMI and SMT segments [30] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the company's foundations for the next phase of growth, despite the CEO's upcoming departure [3] - The company expects Q1 2026 revenue to be in the range of $470 million to $530 million, indicating a decline of 1.8% QoQ and 29.5% year-on-year [28] - There is optimism regarding the mainstream SEMI Solutions business, driven by AI investments and data center build-outs [43] Other Important Information - The company plans to distribute about 50% of annual profits as dividends, with a total dividend payment for 2025 amounting to HKD 1.39 per share [25][26] - The total addressable market (TAM) for TCB is projected to grow from $759 million in 2025 to $1.6 billion by 2028, with a CAGR of 30% [7][8] Q&A Session Questions and Answers Question: TCB addressable market expansion - Management explained that the TAM expansion is primarily driven by increased wafer production for AI chips, with HBM expected to remain a larger portion until later years [38] Question: Rationale for divesting NEXX - The divestment of NEXX is aimed at focusing resources on back-end packaging, which aligns better with the company's strategic direction [41][42] Question: Order visibility for the second half of 2026 - Management clarified that while there is better visibility for the first half of 2026, visibility for the second half remains limited [51] Question: Backlog distribution between SEMI and SMT - The SEMI side backlog is stronger, with a rough distribution of 60% SEMI and 40% SMT [60][61] Question: Impact of restructuring on revenue - The NEXX business, which is being divested, generated about $100 million in revenue, but the overall impact on revenue is not expected to be significant [122]

Financial Data and Key Metrics Changes - The group delivered a revenue of $1.76 billion for the full year 2025, representing a 10.0% year-on-year increase, driven largely by TCB [15][17] - Group bookings reached $1.86 billion, reflecting a 21.7% year-on-year growth, with a book-to-bill ratio of 1.05, the highest since 2021 [15][17] - Group adjusted gross margin was 38.3%, down 172 basis points year-on-year, while operating expenditures increased by 3.2% year-on-year to HKD 4.56 billion [16][17] Business Line Data and Key Metrics Changes - TCB revenue grew approximately 146% year-on-year, contributing significantly to the advanced packaging revenue growth of 30.2% year-on-year [9][12] - The SEMI segment delivered Q4 revenue of $245.6 million, a 19.5% year-on-year increase, while the SMT segment reported Q4 revenue of $263.3 million, up 43.8% year-on-year [19][21] - The mainstream business accounted for about 70% of the fiscal year 2025 group revenue, with AI-related demand driving strong growth [12][13] Market Data and Key Metrics Changes - China remained the largest market, contributing 41% of group revenues, while Europe and Americas saw declines due to soft market conditions [24][25] - The computing end market became the largest contributor to group revenue at 22%, driven by TCB solutions [23][24] - The automotive end market contributed almost 16% to group revenue, supported by EV demand in China [24] Company Strategy and Development Direction - The company is focusing on optimizing its portfolio and streamlining operations to enhance agility and improve margins, particularly in the back-end packaging business [27] - The divestment of ASMPT NEXX has been announced to concentrate resources on back-end packaging, which is seen as a key area for structural growth [27][42] - The company aims to expand its TCB business in a rapidly growing market, driven by AI demand and structural industry growth [30][31] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the company's foundations for the next phase of growth, despite the CEO's upcoming departure [3] - The company anticipates Q1 2026 revenue to be in the range of $470 million-$530 million, with a decline of 1.8% QoQ and 29.5% year-on-year expected [28] - Management noted that while bookings momentum is strong, revenue conversion may be impacted by supply chain tightness [130] Other Important Information - The company has a dividend policy of distributing about 50% of annual profits, with a total dividend payment for 2025 amounting to HKD 1.39 per share [25][26] - The company is committed to investing in core technologies, expecting operating expenditures to rise by about HKD 200 million in 2026 [16] Q&A Session Questions and Answers Question: TCB addressable market expansion - Management explained that the TCB TAM is expected to grow to $1.6 billion by 2028, driven by increased wafer production for AI chips, with HBM currently being the larger portion of the TAM [37][38] Question: Rationale for divesting NEXX - The divestment of NEXX is aimed at focusing on back-end packaging, as NEXX's technology is more aligned with middle-end processes rather than back-end automation [41][42] Question: Order visibility for the second half of 2026 - Management clarified that while there is better visibility for the first half of 2026, the second half still has limited visibility due to market conditions [51][53] Question: Backlog distribution between SEMI and SMT - The SEMI side backlog is stronger, with a rough distribution of 60% SEMI and 40% SMT [60][65] Question: Impact of restructuring on revenue - The NEXX business, which is being divested, generated about $100 million in revenue, but the divestment is not expected to impact overall revenue significantly [121]

Financial Data and Key Metrics Changes - The group delivered a revenue of $1.76 billion for the full year 2025, representing a 10% year-on-year increase, driven largely by TCB [14] - Group bookings reached $1.86 billion, reflecting a 21.7% year-on-year growth, with a book-to-bill ratio of 1.05, the highest since 2021 [14] - Group adjusted gross margin was 38.3%, down 172 basis points year-on-year, while operating expenditures increased by 3.2% year-on-year to HKD 4.56 billion [15] - In Q4 2025, revenue for continuing operations was $508.9 million, up 12.2% QoQ and 30.9% year-on-year [16] Business Line Data and Key Metrics Changes - The Semiconductor Solutions segment delivered Q4 revenue of $245.6 million, a 19.5% year-on-year increase, driven by AI-related applications [18] - The SMT Solutions segment reported Q4 revenue of $263.3 million, up 43.8% year-on-year, supported by AI servers and EVs in China [20] - Advanced packaging revenue grew by 30.2% year-on-year, with TCB contributing significantly to this growth [8] Market Data and Key Metrics Changes - China remained the largest market, contributing 41% of group revenues, while Europe and Americas saw declines due to soft market conditions [23] - The computing end market became the largest contributor to group revenue at 22%, driven by TCB solutions [21] - The automotive end market contributed almost 16% to group revenue, supported by EV demand in China [22] Company Strategy and Development Direction - The company is focusing on optimizing its portfolio and streamlining operations to enhance agility and improve margins, particularly in the back-end packaging business [26] - The divestment of ASMPT NEXX is part of the strategy to concentrate resources on back-end packaging, which aligns with the company's strengths [26] - The company anticipates sustained growth driven by AI demand across both semi and SMT segments [28] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the company's foundations for the next phase of growth despite the CEO's upcoming departure [3] - The company expects Q1 2026 revenue to be in the range of $470 million to $530 million, indicating a decline of 1.8% QoQ and 29.5% year-on-year [27] - Management highlighted that while bookings are expected to be strong, revenue conversion may take longer due to supply chain tightness [133] Other Important Information - The company maintains a dividend policy of distributing about 50% of annual profits, with a total dividend payment for 2025 amounting to HKD 1.39 per share [24] - The company has a target market share of 35%-40% in the TCB segment, supported by strong customer engagements [7] Q&A Session Questions and Answers Question: Can you elaborate on the TCB addressable market expansion? - The TCB TAM is expected to grow to $1.6 billion by 2028, primarily driven by increased wafer production for AI applications, with HBM remaining a larger portion until later years [34][35] Question: What is the rationale for divesting NEXX? - The divestment of NEXX allows the company to focus on back-end packaging, which aligns better with its strengths and the industry's growth trajectory [38] Question: How is the mainstream Semi Solution business expected to progress? - The mainstream business is expected to grow due to increased investments in AI infrastructure and data centers, with visibility for the first half of 2026 looking positive [41][44] Question: What is the order visibility for the second half of the year? - The company has limited visibility for the second half of 2026, but expects better performance in the first half compared to the previous year [51] Question: Can you provide details on the backlog spread between semi and SMT? - The SEMI side backlog is stronger, with a rough estimate of a 60/40 split favoring SEMI [60]