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光莆股份:截至2025年9月19日公司股东总户数为20791户
Zheng Quan Ri Bao· 2025-09-23 07:08
证券日报网讯光莆股份9月22日在互动平台回答投资者提问时表示,截至2025年9月19日,公司股东总户 数(未合并融资融券信用账户)为20791户。 (文章来源:证券日报) ...
光莆股份:公司激光雷达探测传感器件及TOF传感器件、接近/环境光传感器件等已批量出货
Mei Ri Jing Ji Xin Wen· 2025-09-22 08:51
光莆股份(300632.SZ)9月22日在投资者互动平台表示,公司激光雷达探测传感器件及 TOF传感器 件、接近/环境光传感器件、生物识别传感器件均已批量出货,并在智能驾驶、机器人、智能穿戴领域 实现批量销售,具体客户与业务进展请以公司公开披露信息为准。 每经AI快讯,有投资者在投资者互动平台提问:今年车载激光霄达销量暴增,公司和比亚签暑的激光 雷达供货正常吗? (记者 谭玉涵) ...
光莆股份(300632.SZ)光集成传感器封装产品和FPC类产品可应用于AR眼镜
Ge Long Hui· 2025-09-22 08:44
Core Viewpoint - The company Guangpu Co., Ltd. (300632.SZ) has announced that its optical integrated sensor packaging products and FPC (Flexible Printed Circuit) products can be applied in AR (Augmented Reality) glasses [1] Group 1 - Guangpu Co., Ltd. is actively engaging in the development of products suitable for the AR glasses market [1] - The company's optical integrated sensor packaging products are specifically designed for integration into AR technology [1] - FPC products from Guangpu Co., Ltd. are also positioned for use in AR glasses, indicating a strategic focus on this emerging technology [1]
光莆股份:目前,公司已布局光电编码及柔性材料在机器人关节控制上应用
Mei Ri Jing Ji Xin Wen· 2025-09-17 08:52
光莆股份(300632.SZ)9月17日在投资者互动平台表示,公司围绕战略发展方向,积极开展前瞻性技术 研发布局与储备。目前,公司已布局光电编码及柔性材料在机器人关节控制上应用,积极探索柔性传感 器在灵巧手等机器人核心触觉部件上的应用。 每经AI快讯,有投资者在投资者互动平台提问:作为国内领先的柔性传感器(电子皮肤)研发公司, 福莱新材今年发布了第二代柔性触觉传感器,实现了真正的全覆盖,不管是指尖、指腹还是手心、手 背,而且每个部位都具备完整的三维力感知能力。这就像给机器人穿上了一件'智能皮肤',实现了真正 意义上的无死角感知。"请问公司的柔性传感器产品业务拓展的怎么样了? (记者 王晓波) ...
光莆股份:公司的复合集流体小批量用于固态电池上,目前固态电池还未完全上量
Mei Ri Jing Ji Xin Wen· 2025-09-17 08:47
Group 1 - The company has utilized its composite conductive materials in small batches for solid-state batteries, indicating an initial step in this technology application [2] - Currently, solid-state batteries have not yet reached full-scale production, suggesting that the company is in the early stages of this market [2]
光莆股份(300632.SZ)光集成传感器封装产品目前已在机器人等领域应用
Ge Long Hui· 2025-09-17 08:36
Group 1 - The company Guangpu Co., Ltd. (300632.SZ) has announced that its optical integrated sensor packaging products are currently being applied in the robotics sector [1] - The company is actively exploring the application of optoelectronic encoding and flexible materials in robotic joint control [1] - The company is also investigating the use of flexible sensors in core tactile components of robots, such as dexterous hands [1]
光莆股份:公司光集成传感器封测产品已在多领域得到应用
Zheng Quan Ri Bao Wang· 2025-09-15 13:41
Core Viewpoint - The company Guangpu Co., Ltd. (300632) has confirmed that its optical integrated sensor packaging products are currently utilized in well-known brand products across various fields, including robotics, drones, intelligent driving, smart wearables, smartphones, and consumer electronics [1] Group 1 - The company's optical integrated sensor packaging products are applied in multiple sectors [1] - Potential applications of the products include brain-machine interfaces, low-altitude economy, and AI data centers [1]
光莆股份:公司光集成传感器封测产品目前已在机器人、无人机、智能驾驶等领域的知名品牌产品中得应用
Mei Ri Jing Ji Xin Wen· 2025-09-15 08:58
Group 1 - The company, Guangpu Co., Ltd. (光莆股份), has provided insights into its optical sensor products and their applications in various industries [2] - The optical integrated sensor packaging products are currently utilized in well-known brand products across fields such as robotics, drones, intelligent driving, smart wearables, smartphones, and consumer electronics [2] - Additionally, these sensors can be applied in emerging areas such as brain-computer interfaces, low-altitude economy, and AI data centers [2]
光莆股份:将在光博会展示2.5D及微型光电共封等先进光集成传感器封测产品
人民财讯9月15日电,光莆股份(300632)9月15日在互动平台回复称,公司将在光博会展示2.5D及微型 光电共封等先进光集成传感器封测产品。这些产品可广泛应用于机器人、人工智能、智能穿戴、脑机接 口、低空经济、智能驾驶、消费电子等领域。 ...
光莆股份:目前公司的光集成传感3D叠Die封装产品主要应用在智能手机等产品中
Zheng Quan Ri Bao Wang· 2025-09-05 10:46
Group 1 - The core viewpoint of the article highlights that Guangpu Co., Ltd. (300632) is actively engaging with investors regarding its 3D stacked die packaging products, which are primarily used in various advanced technologies such as smartphones, smart wearables, drones, robots, and AR/VR devices [1] - The company's 3D stacked packaging technology is derived from high bandwidth memory (HBM) technology, indicating a potential for technological synergy and expanded applications in the market [1]