Key Takeaways IONQ is poised for long-term upside as quantum growth moderates in 2026 after rapid expansion in 2024-2025.IBM advances quantum progress with new processors, Qiskit expansion and DARPA benchmarking targets for 2026.D-Wave Quantum shows early optimization traction, but annealing systems remain exposed to funding cycles.Quantum computing remains in a nascent yet strategically critical phase, with global revenues projected to reach $2 billion this year (as per an investing.com report), driven lar ...

来源：市场资讯 （来源：科创100ETF基金） 道琼斯工业平均指数首次突破50,000点大关，成分股中英伟达涨超7%，卡特彼勒涨超6%，高盛、摩根 大通涨超4%，迪斯尼、IBM涨超3%，联合健康、沃尔玛、思科涨超2%。 ...

We recently published Jim Cramer Discussed These 12 Stocks & Wondered Whether He Should Melt Silver. International Business Machines Corporation (NYSE:IBM) is one of the stocks that Jim Cramer discussed. International Business Machines Corporation (NYSE:IBM) is one of Cramer’s top stocks in the technology space. Over the past couple of months, the CNBC TV host has praised the firm’s quantum computing business. International Business Machines Corporation (NYSE:IBM)’s shares are up by 9.8% over the past yea ...

作者：情报员 声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 国家知识产权局信息显示，国际商业机器公司取得一项名为"防篡改混淆电路"的专利，授权公告号 CN115803741B，申请日期为2021年7月。 ...

声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 国家知识产权局信息显示，国际商业机器公司取得一项名为"改善磁共振成像注释"的专利，授权公告号 CN114550882B，申请日期为2021年11月。 作者：情报员 ...

营销智能体 丨 研究报告 核心摘要： 观察过去近二十年AI发展史，企业营销永远是率先落地的场景。智能体作为当前全球AI最热门方向，全球泛营销SaaS巨头如 Adobe, S alesforce, Hubspot, Applovin等都为自己贴上了营销智能体的标签。AI对企业营销和营销服务商，已从辅助工具逐渐迈向全链路自主决策系统的过程。中国营销技术企业正凭借工程师红 利和实战打磨的技术可靠性，重塑企业营销管理范式，同时在助力中企出海过程中，面对语言文化差异、营销人才缺失等挑战，极大降低了出海营销门槛和起步效 率。艾瑞率先发布国内首份营销智能体白皮书，希望为国内营销技术探索提供有价值的思考。 市场趋势与全球动态 三大变化：平台投放环境变化加速、隐私要求上升、企业加大数字营销投入 全球营销智能体的应运而生 从辅助预测分析到全链路营销自动化 计算机技术在营销领域的应用正在经历一场深刻的转型：它已经从最初仅仅承担数据分析与辅助决策的工具角色，逐渐演进为能够覆盖创意生成、投 放策略、效果监测与优化等在内的全链路营销自动化系统。一些头部SaaS与广告平台开始推出智能投放套件和创意生成工具。尤其是在海外市场，越 来越多的品 ...

WASHINGTON, Feb. 5, 2026 /PRNewswire/ -- IBM (NYSE: IBM) today announced it was selected to support the Missile Defense Agency's Scalable Homeland Innovative Enterprise Layered Defense (SHIELD) program. This indefinite-delivery/indefinite-quantity (IDIQ) contract, with a ceiling of $151 billion, encompasses a broad range of work areas that allow for the rapid delivery of innovative capabilities to the warfighter with increased speed and agility. IBM has supported the U.S. federal government for nearly a cen ...

Core Viewpoint - The article discusses the challenges of heat dissipation in modern semiconductor technology, particularly as transistor sizes shrink and power density increases due to advancements in artificial intelligence. IBM's Thermonat project aims to address these challenges by modeling semiconductor thermal behavior at the atomic level, achieving unprecedented accuracy and speed in predictions [2][3][6]. Group 1: Heat Dissipation Challenges - The speed of new smartphone releases has slowed due to heat dissipation issues arising from increased processing power in confined spaces [2]. - The shrinking size of transistors has led to significant heat generation, complicating the design of cooling systems for new chips [3][6]. Group 2: IBM's Thermonat Project - IBM's Thermonat project focuses on overcoming heat dissipation challenges by accurately modeling thermal behavior in semiconductors, achieving prediction accuracy within 1 degree Celsius, which is 0.002% [6]. - The project utilizes machine learning to create simplified models that maintain accuracy while reducing data processing requirements, resulting in simulation speeds that are 50,000 times faster than existing methods [5][6]. Group 3: Multidisciplinary Approach - The success of the Thermonat project is attributed to the collaboration of multidisciplinary experts within IBM, including materials scientists and thermal system specialists, leveraging extensive internal semiconductor data [8]. - The project also benefits from partnerships with companies like Synopsys, utilizing advanced machine learning techniques to enhance model accuracy and speed [8]. Group 4: Implications for Chip Design - Improved thermal modeling tools will enable engineers to design chip layouts that consider heat dissipation, potentially enhancing chip performance and efficiency [3][9]. - The methodologies developed in the Thermonat project can be applied broadly across semiconductor applications where heat generation is a concern, indicating a versatile tool for future chip development [9].

公众号记得加星标⭐️，第一时间看推送不会错过。 将系统拆分成多芯片（multi-die）组件，可以优先处理不同的处理器和功能，同时简化在非关键组件 短缺时的应急预案。此外，无需将所有组件都塞进最先进的工艺节点上尺寸与光罩大小相同的SoC芯 片中，而是可以根据实际情况选择合适的工艺节点来开发不同的芯片。 缩小功能尺寸对某些逻辑电路仍然很重要，但能够扩展到最先进节点的功能在整体设计中所占的比例 越来越小。另一方面，只要处理器和内存之间的数据传输速度足够快，能够处理爆炸式增长的人工智 能数据，就可以添加更多以芯片组形式存在的晶体管来提升性能。 " 具 体 到 2nm 工 艺 ， 这 些 复 杂 的 集 成 系 统 中 可 能 只 有 少 数 部 件 会 采 用 最 先 进 的 技 术 节 点 ， " Lam Research公司副总裁David Fried表示。"最终会形成一种优化。你需要为系统的每个元件选择最佳技 术。过去，我们通过单片集成来优化功耗、性能、面积和成本。而先进封装技术使我们能够针对各个 子系统优化功耗、性能、面积和成本。其结果通常是通过异构集成将不同的技术结合起来。芯片组是 分层系统集成的自然演进 ...

The U.S. stock market is experiencing mixed trading patterns on Wednesday, February 4th, 2026, with a notable rotation out of technology giants and into broader market sectors. While the Dow Jones Industrial Average shows resilience, major tech stocks continue to weigh heavily on the S&P 500 and Nasdaq Composite, marking a second consecutive day of pressure for the tech-heavy indexes. Investors are closely monitoring a flurry of earnings reports and key economic data releases, which are shaping midday marke ...