证券研究报告·公司深度研究·风电设备 德力佳（603092） 风电齿轮箱领军者，海风放量开启第二曲线 2026 年 02 月 26 日 买入（首次） | [Table_EPS] 盈利预测与估值 | 2023A | 2024A | 2025E | 2026E | 2027E | | --- | --- | --- | --- | --- | --- | | 营业总收入（百万元） | 4,442 | 3,715 | 5,454 | 6,359 | 7,209 | | 同比（%） | 42.92 | (16.36) | 46.79 | 16.60 | 13.37 | | 归母净利润（百万元） | 633.96 | 533.79 | 815.85 | 1,076.96 | 1,339.97 | | 同比（%） | 17.36 | (15.80) | 52.84 | 32.01 | 24.42 | | EPS-最新摊薄（元/股） | 1.58 | 1.33 | 2.04 | 2.69 | 3.35 | | P/E（现价&最新摊薄） | 42.98 | 51.05 | 33.40 | 25.30 | 20.33 | [T ...

证券研究报告·公司深度研究·风电设备 德力佳（603092） 风电齿轮箱领军者，海风放量开启第二曲线 2026 年 02 月 26 日 证券分析师 曾朵红 买入（首次） | [Table_EPS] 盈利预测与估值 | 2023A | 2024A | 2025E | 2026E | 2027E | | --- | --- | --- | --- | --- | --- | | 营业总收入（百万元） | 4,442 | 3,715 | 5,454 | 6,359 | 7,209 | | 同比（%） | 42.92 | (16.36) | 46.79 | 16.60 | 13.37 | | 归母净利润（百万元） | 633.96 | 533.79 | 815.85 | 1,076.96 | 1,339.97 | | 同比（%） | 17.36 | (15.80) | 52.84 | 32.01 | 24.42 | | EPS-最新摊薄（元/股） | 1.58 | 1.33 | 2.04 | 2.69 | 3.35 | | P/E（现价&最新摊薄） | 42.98 | 51.05 | 33.40 | 25.30 | ...

证券研究报告·公司点评报告·电网设备 金盘科技（688676） 2025 年业绩快告点评：业绩符合市场预期， SST 进展值得期待 买入（维持） | [Table_EPS] 盈利预测与估值 | 2023A | 2024A | 2025E | 2026E | 2027E | | --- | --- | --- | --- | --- | --- | | 营业总收入（百万元） | 6,668 | 6,901 | 7,299 | 8,455 | 10,500 | | 同比（%） | 40.50 | 3.50 | 5.78 | 15.83 | 24.18 | | 归母净利润（百万元） | 504.66 | 574.42 | 659.95 | 891.92 | 1,217.20 | | 同比（%） | 78.15 | 13.82 | 14.89 | 35.15 | 36.47 | | EPS-最新摊薄（元/股） | 1.10 | 1.25 | 1.44 | 1.94 | 2.65 | | P/E（现价&最新摊薄） | 92.82 | 81.55 | 70.98 | 52.52 | 38.48 | [Table_Tag] ...

证券研究报告·公司点评报告·电网设备 金盘科技（688676） 2025 年业绩快告点评：业绩符合市场预期， SST 进展值得期待 ◼ 风险提示： AIDC 业务发展不及预期、原材料成本上涨、竞争加剧等。 2026 年 02 月 26 日 证券分析师 曾朵红 执业证书：S0600516080001 021-60199793 zengdh@dwzq.com.cn 证券分析师 司鑫尧 执业证书：S0600524120002 sixy@dwzq.com.cn 买入（维持） | [Table_EPS] 盈利预测与估值 | 2023A | 2024A | 2025E | 2026E | 2027E | | --- | --- | --- | --- | --- | --- | | 营业总收入（百万元） | 6,668 | 6,901 | 7,299 | 8,455 | 10,500 | | 同比（%） | 40.50 | 3.50 | 5.78 | 15.83 | 24.18 | | 归母净利润（百万元） | 504.66 | 574.42 | 659.95 | 891.92 | 1,217.20 | | 同比（%） ...

证券研究报告·行业研究·电力设备与新能源行业 需求超预期，开启26-27年向上新周期 ——碳酸锂专题 电新首席证券分析师 ：曾朵红 执业证书编号：S0600516080001 联系邮箱：zengdh@dwzq.com.cn 电动车首席证券分析师 ：阮巧燕 执业证书编号：S0600517120002 联系邮箱：ruanqy@dwzq.com.cn 联系电话：021-60199793 2026年2月26日 请务必阅读正文之后的免责声明部分 1 摘要 注：全文的"预计"若无特别说明，均为东吴证券研究所预测 ◆ 供给：增量供给为非矿、澳矿、国内盐湖，增量多集中于26H2。中性情况下，26年全球锂矿供给214万吨， 新增44万吨，若津巴布韦锂精矿出口恢复低于预期，则实际新增更低；27年262万吨，新增48万吨；28年 303万吨，新增41万吨。其中，26年增量主要来自：国内盐湖新增8.4万吨（麻米措、察尔汗、拉果措）、国 内矿山6.6万吨（枧下窝复产、新疆红柳滩、党坝、加达、湘源矿）、海外盐湖6.9万吨（3Q、Mariana和 CO）、澳矿的7.8万吨（泰利森和皮尔巴拉以及Marion等矿山达产）、非矿11.5万吨（中 ...

证券研究报告·北交所报告·北交所专题报告 北交所专题报告 20260226 工程机械复苏动能稳步释放，建议关注北交 所工程机械相关标的 [Table_Tag] [Table_Summary] 观点 2026 年 02 月 26 日 证券分析师 朱洁羽 执业证书：S0600520090004 zhujieyu@dwzq.com.cn 证券分析师 易申申 执业证书：S0600522100003 yishsh@dwzq.com.cn 证券分析师 余慧勇 执业证书：S0600524080003 yuhy@dwzq.com.cn 研究助理 武阿兰 执业证书：S0600124070018 wual@dwzq.com.cn 研究助理 陈哲晓 执业证书：S0600124080015 sh_chenzhx@dwzq.com.cn 相关研究 《年度业绩快报密集发布，北证 50 上 涨 0.77%》 2026-02-25 《人民银行开展 5260 亿元 7 天期逆 回购操作，北证 50 上涨 0.37%》 2026-02-24 东吴证券研究所 1 / 21 请务必阅读正文之后的免责声明部分 ◼ 工程机械行业自 2025 年下半年进 ...

Market News - Shanghai has initiated the first major relaxation of housing purchase restrictions in 2026, implementing a "new seven measures" to lower barriers for non-local buyers and improve housing loan conditions[6] - The new policy is expected to stimulate demand in the real estate market, leading to a "volume increase and price stability" trend in Shanghai's housing market[7] Industry News - Short-seller Citron Capital has taken a short position against SanDisk, citing cyclical pressures in the NAND industry and increased competition from Samsung, causing SanDisk's stock to drop over 8%[9] - During the recent Spring Festival holiday, sales of home appliances and digital products exceeded 5.1 million units, marking a 21.7% increase compared to last year[11] Market Performance - As of February 25, 2026, the North Exchange 50 index rose by 0.77%, while the ChiNext index increased by 1.41% and the A-share index rose by 0.73%[12] - The average market capitalization of the 294 constituent stocks in the North Exchange is 3.214 billion, with a trading volume of 18.656 billion, an increase of 2.277 billion from the previous trading day[12] Company Announcements - Companies such as Thunder God Technology and Haidaer have released their annual performance reports, with Thunder God reporting a revenue of 3.042 billion, a year-on-year increase of 2.93%[23] - Haidaer reported a revenue of 371 million, a decrease of 11.15% year-on-year, with a net profit decline of 20.21%[33] Risk Warning - There are risks of individual stock earnings falling short of expectations, intensified industry competition, and potential trade frictions impacting market stability[36]

证券研究报告·行业深度报告·电子 电子行业深度报告 AI 基建，光板铜电—GTC 前瞻 Serdes，Rubin Ultra&CPO 交换机详解 增持（维持） [Table_Tag] [Table_Summary] 投资要点 ◼ 建议关注 M9 PCB 产业链：菲利华、东材科技、生益科技、胜宏科技、沪电股 份、深南电路、东山精密等 CPO 产业链：致尚科技、长光华芯、源杰科技、仕佳光子、太辰光、 炬光科技、罗博特科等 ◼ 风险提示：算力互联需求不及预期，客户拓展及份额提升不及预期，产 品研发及量产落地不及预期，行业竞争加剧 2026 年 02 月 25 日 证券分析师 陈海进 执业证书：S0600525020001 chenhj@dwzq.com.cn 研究助理 解承堯 东吴证券研究所 1 / 21 请务必阅读正文之后的免责声明部分 执业证书：S0600125020001 xiechy@dwzq.com.cn 行业走势 -22% -15% -8% -1% 6% 13% 20% 27% 34% 41% 48% 2025/2/25 2025/6/26 2025/10/25 2026/2/23 电子 沪深300 相 ...

证券研究报告 东吴证券晨会纪要 东吴证券晨会纪要 2026-02-26 [Table_Tag] 宏观策略 [Table_MacroStrategy] 宏观深度报告 20260225：从利率曲线"久期分割"看 2026 年货币政策空 间 今年有"降息"的空间和概率，但节奏上需要视经济增长和金融市场形势 综合研判，基准预期为主要政策利率——7 天期逆回购利率或有 1 次"降 息"操作、或有 50bps 左右的"降准"操作，同时保留 2 次"降息"的可 能。 固收金工 [Table_FixedGain] 固收深度报告 20260225：债券"科技板"他山之石：海外科技巨头债券 融资路径演变案例复盘之半导体行业 半导体产业"高资本密集、高技术壁垒、长投资周期"的固有属性，对其 融资体系提出了严峻挑战。一方面，先进制程产线投资动辄千亿，核心设 备价格高昂，且技术迭代迫使企业进行持续性的高额资本开支；另一方 面，从研发到量产的转化周期长、风险高，叠加全球供应链的不确定性， 企业对稳定、长期、且成本可控的资金来源需求较为迫切。审视国内，尽 管 2025 年"债券科技板"已将半导体企业纳入重点支持范畴，但债券市 场的服务能力 ...

1. Report Industry Investment Rating - The document doesn't provide the industry investment rating. 2. Core Viewpoints of the Report - The semiconductor industry is of strategic importance, but its financing system faces challenges. The report analyzes the bond financing strategies of three overseas semiconductor companies to provide reference for Chinese semiconductor companies and the domestic bond market [9][10][11]. 3. Summary According to the Directory 3.1 Asia: SK Hynix Inc - **Company Overview**: A global leading semiconductor storage solutions provider, focusing on memory chips with products like DRAM, NAND flash, and CIS. In 2025, it became the world's largest DRAM manufacturer and had a strong position in other markets [12][14][15]. - **Development Path**: It went through four stages: "start - up and foundation - building (1983 - 1998)", "scale expansion (1999 - 2011)", "strategic transformation (2012 - 2020)", and "AI - enabled (2021 - 2025)". It achieved strategic upgrades through technology iteration and capacity expansion [16][17][20]. - **Bond Issuance History and Changes**: The bond - issuing mode evolved from "point - like exploratory financing" to "normalized, large - scale, diversified strategic financing". The financing strategy changed in different stages, with the bond financing frequency, term, and coupon rate showing corresponding characteristics [24][31][34]. 3.2 Europe: ASML Holding NV - **Company Overview**: The global leader in semiconductor lithography equipment, with a monopoly in the EUV market. Its products include EUV, DUV lithography equipment, and related services. In 2025, it further consolidated its monopoly position [46][47][48]. - **Development Path**: It went through three stages: "breaking through difficulties (1984 - 2007)", "technological monopoly (2007 - 2013)", and "ecosystem binding (2013 - present)". It achieved a leading position through technological focus and strategic choices [49][50][54]. - **Bond Issuance History and Changes**: The bond - issuing mode evolved from "supplementary financing" to "strategic supporting financing". The financing strategy was adjusted according to different development stages, with the bond financing frequency, term, and coupon rate changing accordingly [57][62][65]. 3.3 United States: Broadcom Inc - **Company Overview**: A global leading provider of semiconductor chips and infrastructure software solutions, with a dual - business pattern of "semiconductor chips + infrastructure software". It ranked 7th in the global semiconductor companies in 2025 [77][79]. - **Development Path**: It went through three stages: "merger and acquisition expansion (1991 - 2013)", "technology integration (2013 - 2018)", and "chip + software ecosystem closed - loop (2018 - present)". It reshaped its business through mergers and acquisitions [81][82][85]. - **Bond Issuance History and Changes**: The bond - issuing mode evolved from "supplementary R & D financing" to "merger - driven large - scale financing". The financing strategy was closely related to the merger and acquisition process, with the bond financing frequency, term, and coupon rate showing different characteristics in different stages [86][93][94].