Core Insights - Quantum eMotion Corp. has successfully completed and validated its first-generation Quantum Random Number Generator (QRNG) chip design, which is now in fabrication with TSMC [1][2] - The QRNG chip utilizes quantum electron tunneling to produce random bits at speeds exceeding 1 Gbit/sec, making it suitable for cybersecurity applications [3][4] - The global QRNG chip market is projected to grow from approximately USD 150 million in 2024 to USD 2 billion by 2033, with a CAGR of 34.5% from 2026 to 2033 [5] Company Developments - The finalized QRNG chip design has passed all simulations and lab tests, confirming its capability for high-speed random number generation [2] - The chip integrates an ultra-low-noise wideband amplifier and a high-precision analog-to-digital converter, validated by academic teams [3] - The company aims to enhance digital security against emerging quantum threats through its patented QRNG technology [5][6] Market Potential - The QRNG chip is targeted at various sectors, including Financial Services, Healthcare, Blockchain Applications, and Cloud-Based IT Security Infrastructure [8] - The increasing demand for affordable hardware and software security solutions for connected devices positions Quantum eMotion as a pioneering force in the cybersecurity market [6]

⑧【台积电将生产基于MicroLED的光通信互连产品】台积电周一宣布，将与美国初创公司Avicena合 作，生产基于MicroLED的互连产品。该技术用光通信替代电连接，以低成本、高能效的方式满足越来 越多的GPU之间的高通信需求。 ④【瑞银看多英镑兑美元目标价至1.38】瑞银集团外汇策略团队最新报告指出，英镑上行空间尚未完全 释放，建议投资者把握回调买入机会。该机构明确将1.3390设定为关键加仓点位，并上调英镑兑美元目 标价至1.38，较当前价位仍有超2%的潜在涨幅。瑞银分析指出，当前美元走势与美债收益率出现罕见 背离：尽管10年期美债收益率持续攀升，但美元指数却逆势下跌。 ⑤【美联储卡什卡里呼吁维持利率稳定，等待关税影响明确】美国明尼阿波利斯联邦储备银行主席尼 尔・卡什卡里周二呼吁维持利率稳定，直至关税对通胀的影响更加明确，并警告不要忽视此类供应端价 格冲击的影响。 ⑥【美银：抄底美债的机会来了】美银首席投资官Hartnett在最新报告中表示，30年期美债收益率突破 5%，已构筑起一个颇具吸引力的买入窗口，尽管这在当前市场情绪下可能是最不受欢迎的交易之一。 根据美银的数据，美国10年期国债的滚动回报率已 ...

Group 1 - TSMC announced a collaboration with US startup Avicena to produce MicroLED-based interconnect products [1] - The technology utilizes optical communication to replace electrical connections, addressing the increasing high communication demands between GPUs [1] - This approach aims to provide a low-cost and energy-efficient solution for the growing needs in the industry [1]

近日，据中国台湾《中国时报》5月24日报道，台积电美国亚利桑那州子公司提交给美国商务部的意见 信内容曝光，在半导体产业引发强烈震动。这封意见信不仅透露出台积电在美国的庞大投资规划，更 以强硬姿态对美国的贸易政策划出红线 ，而与之形成鲜明对比的是台当局在面对美国半导体进口"232 调查"时的态度，两者有着截然不同的表现。 中国台湾《中国时报》深入分析了台积电赴美投资后遭遇的种种问题，如位于亚利桑那的新厂2023年亏 损新台币142.98亿（约32亿人民币），四年累计亏损超新台币394亿元（约12亿美元），而中国大陆南 京厂同年却实现新台币260亿元盈利，鲜明的对比凸显出赴美投资的风险。财经专家阮慕骅指出，台积 电大举赴美带来资金排挤效应、技术外流以及供应链控制权让渡等"三大危机"，媒体对这些观点的传 播，也让民众更加清晰地认识到美国关税威胁以及台当局错误决策对台湾地区产业的巨大伤害。 加入"中国IC独角兽联盟"，请点击进入 投稿 、 商务合作 请微信 dolphinjetta 是说芯语，欢迎关注分享 台积电的历史及在美生产现况 ：信中提到台积电早在1998年便在美国设厂，2020年在亚利桑那州 启动大规模晶圆厂 ...

Core Viewpoint - Xiaomi's ambitious plan to develop its own 3nm SoC chips may face challenges due to potential restrictions on collaboration with TSMC amid ongoing US-China trade tensions [1][2][3] Group 1: Xiaomi's Chip Development - Xiaomi has announced plans to invest at least 50 billion RMB (approximately 6.9 billion USD) over the next decade to develop its own chips, starting from 2025 [1] - The first self-developed SoC chip, "XRING 01," was launched using TSMC's second-generation 3nm process, aimed at competing with advanced chips like Apple's A18 Pro [2][5] - The company has not disclosed how many SoC chips it plans to produce, indicating uncertainty in its production scale [1][5] Group 2: Potential Collaboration Issues - The US government may impose restrictions on TSMC's collaboration with Xiaomi to prevent the rapid advancement of Chinese AI chip technology [2] - Concerns exist that Xiaomi's technology could be shared with other Chinese companies, giving them a competitive edge [2] Group 3: Market Position and Competition - Despite launching its own chip, Xiaomi is expected to continue relying on Qualcomm and MediaTek for approximately 40% of its smartphone components [2][3] - Qualcomm's CEO stated that Xiaomi's announcement of its first smartphone chip would not impact Qualcomm's business, highlighting the ongoing reliance on established suppliers [3] Group 4: Performance of Xiaomi's SoC - Initial performance tests of the "XRING 01" chip showed disappointing results, underperforming by 13% compared to Xiaomi's claims and falling short against Qualcomm's Snapdragon 8 Elite and MediaTek's Dimensity 9400 [4][5] - The integration of hardware and software in Xiaomi's SoC aims to provide a unique user experience, although the initial performance raises concerns about its competitiveness [5]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自经济日报 。 半导体业界流传日本化工巨头旭化成（Asahi KASEI）对客户发出的通知，提到因该公司产能无法 跟上市场需求，将对部分客户断供先进封装关键耗材感光型聚醯亚胺（PSPI），业界忧心恐导致 AI断链危机一触即发。 业界指出，目前没有任何材料能全面替代PSPI在所有先进封装制程中的性能，考量先进封装是AI 芯片生产关键技术，若缺少PSPI导致先进封装产能供给受限，不仅牵动台积电（2330）、日月光 投控、群创等业者先进封装业务接单，进而冲击全球AI产业发展。业界分析，旭化成是全球PSPI 数一数二关键供应商，以封装材料来说，旭化成和HD（杜邦与日立合资公司）居前两大，一旦供 货不足，牵动整个半导体生态。 根据业界人士转述，此次旭化成拟对部分客户断供其PIMEL系列感光材料供应，即PSPI相关产 品，主因AI高速发展，使得算力需求快速增长，对先进封装需求暴增，同步带动PSPI需求劲扬， 该公司产能无法及时跟上市场需求。 业界人士说，旭化成的PSPI材料，在半导体封装领域具有关键应用价值，并广获半导体指标厂采 用，主要用于元件表面保护层、凸块钝化层 ...

Core Viewpoint - TSMC partners with startup Avicena to produce MicroLED-based interconnect products, aiming to replace electrical connections with optical ones to meet the increasing communication demands between GPUs in AI data centers [1][4]. Group 1: Technology Overview - The collaboration focuses on using optical connections to address unprecedented demands for data volume, bandwidth, latency, and speed in AI clusters due to large language models [1]. - Avicena's LightBundle platform utilizes hundreds of blue MicroLEDs connected through imaging-type optical fibers to transmit data, avoiding the complexities associated with lasers [1][4]. - The technology allows for a simple optical fiber link that can transmit data at 10 Gb/s over distances exceeding 10 meters, achieving net transmission rates of up to 3 Tb/s [4]. Group 2: Industry Context - The optical interconnect technology is positioned as a solution to the challenges faced by laser-based optical interconnects, which struggle with reliability, manufacturing, and cost issues [3][4]. - Avicena's approach leverages existing technologies in LEDs, cameras, and displays, which are already mature industries, allowing for quicker adjustments in production methods [6][7]. - TSMC's involvement in producing optical detector arrays for Avicena highlights the potential for lower costs and higher efficiency compared to traditional laser-based systems [7]. Group 3: Competitive Advantage - Avicena claims that their technology can achieve energy consumption as low as sub-picojoules per bit, outperforming other optical methods that find it difficult to reach 5 picojoules per bit [7]. - The simplicity of the LightBundle design, requiring only minor modifications to existing camera and display technologies, positions it favorably against more complex silicon photonics solutions [6][7].

半导体业界流传日本化工巨头旭化成（Asahi KASEI）对客户发出的通知，提到因该公司产能无法跟上 市场需求，将对部分客户断供先进封装关键耗材感光型聚醯亚胺（PSPI），业界忧心恐导致AI断链危 机一触即发。 先进封装爆红，三星、英特尔、日月光投控、群创等大厂也积极抢进，进一步消耗PSPI产能。随着旭化 成对部份客户断供，业界忧心AI断链危机一触即发。 对于相关消息，至昨（26）日截稿前，台积电未回应。业界分析，台积电是全球晶圆代工龙头，应会获 得旭化成优先供货，研判对台积电影响不大。不过，对正积极强化先进封装能量日月光投控而言，旭化 成PSPI供货不顺，可能会打乱原先集团布局规划。惟日月光投控对此不予回应。 日月光投控内部规划，目标2025年CoWoS先进封装月产可达1万片，力拚今年相关业绩倍增至10亿美元 以上。 业界人士说，旭化成的PSPI材料，在半导体封装领域具有关键应用价值，并广获半导体指标厂采用，主 要用于元件表面保护层、凸块钝化层及RDL绝缘层，在晶圆级封装（WLP）制程中，晶圆表面钝化层 及RDL重布线层介质制造需依赖光敏绝缘材料，由于PSPI的独特优点在于兼具光敏特性与绝缘性能，可 显著简 ...

Core Viewpoint - The article provides an overview of TSMC's wafer fabrication capacity across various fabs, highlighting the production capabilities and expected changes in output for the upcoming quarters. Group 1: TSMC's Fab Capacity Overview - TSMC operates a total of 17 fabs located in Hsinchu, Tainan, Shanghai, Nanjing, Kaohsiung, Washington, and Arizona [2][4]. - The data presented in the article is measured in KWPM, indicating the monthly capacity in thousands of wafers [3]. Group 2: Hsinchu Fabs - Hsinchu has the highest number of fabs, totaling seven, with capacities of 30, 60, 41, 93, 135, and 3 KWPM for the respective fabs [4]. - It is expected that the production capacity will remain stable in the latter half of the year, with Fab 20 showing a slightly higher increase [4]. Group 3: Tainan Fabs - Tainan houses three fabs: Fab 6 (8-inch), Fab 14 (12-inch), and Fab 18 (12-inch), with capacities of 102, 338, and 242 KWPM respectively [5][6]. - A slight reduction in production is anticipated for Fab 6 and Fab 14, while Fab 18's capacity is expected to increase [5]. Group 4: Shanghai Fab - Shanghai has one fab, Fab 10, with a monthly capacity of 105 KWPM, which is expected to remain relatively stable in the upcoming quarters [7][8]. Group 5: Washington Fab - Washington has one 8-inch fab, Fab 11, with a capacity fluctuating between 23 and 30 KWPM [9][10]. Group 6: Taichung Fab - Taichung has one 12-inch fab, Fab 15, with a first-quarter capacity of 287 KWPM, which is expected to experience slight fluctuations [11][12]. Group 7: Nanjing Fab - Nanjing has one 12-inch fab, Fab 16, which is focused on mature processes (28nm and above) [13][14]. Group 8: Arizona Fab - Fab 21 in Arizona is under construction, with production of 4nm chips expected to begin by the end of 2024, indicating currently low capacity [15][16]. Group 9: Kaohsiung Fab - Fab 22 in Kaohsiung is planned for 2nm processes, with multiple phases of construction; currently, the capacity is at zero [17].

在5月24日台积电在亚利桑那州的子公司"上书"美国商务部，罕见对美释放强硬态度，称如果美国对芯 片征收关税，台积电将延缓在亚利桑那州的后续投资计划。 台积电前期在美国投资的工厂面临工人短缺、管理混乱、成本高昂等问题，而且大量工程师需要从台湾 外调。后期有可能将面临美国的关税和东国芯片产业的双重冲击，如果东国实现3纳米高端芯片的量 产，到时台积电不仅会丢掉技术优势，还会丧失成本优势。 这次台积电声明中，前两部分说明了台积电目前在美生产现状和对美的投资力度，最后一部分"图穷匕 见"声明如果美国对芯片征收关税"将使台积电客户的电子产品需求显著降低，导致营收陡降，强烈建议 美国政府不应对半导体课征关税或其他进口管制，否则将影响对亚利桑那州厂投资进度。"目前台积 电"强硬声明"仅为"策略性警告"，实质想借此来"逼迫"美国取消芯片关税，避免企业后期可能由此产生 的经济损失。如果美国强力推行芯片关税，台积电作为一个企业，前期已经产生了大量的"沉没成本"后 期只能"自吞苦果" 人人路过踢两脚，川普骚操作让美国成了纸老虎？ 台积电有了强硬的声明，后续是否能有强硬的动作？ 台积电之前在川普的威逼利诱下，在美豪掷1650亿建设6座 ...