Financial Performance - For the six months ended June 30, 2024, the company reported revenue of HKD 79,612,000, a decrease of 16.4% compared to HKD 95,216,000 for the same period in 2023[3] - Gross profit for the same period was HKD 27,936,000, down 25.8% from HKD 37,635,000 year-on-year[3] - The company recorded a loss attributable to shareholders of HKD 9,461,000 for the six months ended June 30, 2024, compared to a profit of HKD 3,668,000 in the previous year[3] - Total comprehensive income for the period was HKD (10,914,000), a significant decline from HKD 4,645,000 in the prior year[2] - Revenue for the six months ended June 30, 2024, was HKD 79,612 thousand, a decrease of 16.4% compared to HKD 95,216 thousand for the same period in 2023[11] - Sales of pallets and related products amounted to HKD 73,535 thousand, down from HKD 87,980 thousand, representing a decline of 16.4%[11] - The revenue from MEMS and sensor packaging was HKD 5,538 thousand, compared to HKD 7,084 thousand, reflecting a decrease of 21.8%[11] - The Southeast Asia market generated revenue of HKD 25,995 thousand, down 27.4% from HKD 35,792 thousand in the previous year[11] - The company reported a pre-tax loss of HKD 7,828 thousand after accounting for listing expenses of HKD 8,363 thousand[14] - The adjusted pre-tax profit (excluding non-recurring listing expenses) was HKD 535,000, compared to HKD 6.8 million in the same period last year, with a reported loss of HKD 9.5 million after accounting for listing expenses of approximately HKD 8.4 million[60] Assets and Liabilities - Non-current assets increased to HKD 69,089,000 as of June 30, 2024, compared to HKD 66,497,000 at the end of 2023[4] - Current assets decreased to HKD 148,312,000 from HKD 138,444,000 at the end of 2023[4] - The company's cash and cash equivalents rose significantly to HKD 33,631,000 from HKD 1,073,000 at the end of 2023[4] - Total liabilities decreased to HKD 118,914,000 from HKD 128,685,000 at the end of 2023[4] - The company has a net asset value of HKD 86,095,000 as of June 30, 2024, compared to HKD 61,377,000 at the end of 2023[5] - Trade receivables, net of credit loss provisions, were HKD 29,209,000 as of June 30, 2023, compared to HKD 32,742,000 as of December 31, 2024, reflecting a decrease of approximately 10%[34] - Total trade payables increased from HKD 52,466,000 as of June 30, 2023, to HKD 55,828,000 as of December 31, 2024, representing an increase of about 6.5%[37] - Bank borrowings, including secured loans and trade receivables financing, totaled HKD 54,207,000 as of June 30, 2023, down from HKD 50,996,000 as of December 31, 2024[39] - The company’s total current liabilities, including bank borrowings due within one year, were HKD 49,262,000 as of June 30, 2023, compared to HKD 44,675,000 as of December 31, 2024[40] Operational Focus - The company is focused on the research, development, manufacturing, and sales of semiconductor packaging and MEMS sensors[6] - The company continues to focus on the manufacturing and sales of backend semiconductor transmission medium products and MEMS and sensor packaging[14][15] - The company is focused on precision manufacturing of engineering plastics, particularly in the design, development, manufacturing, and sales of pallets and related products[47] - The company plans to expand its operations in the Philippines, focusing on carrier tape manufacturing to enhance operational efficiency and delivery capabilities[53] - The company aims to strengthen its sales and marketing efforts in key global markets, particularly in China, by establishing new sales points in Shenzhen and Chengdu[53] - The company is enhancing its R&D programs to improve product offerings and meet the evolving demands of high-quality customers[54] Market Position and Strategy - The company ranked third globally in sales revenue within the semiconductor packaging industry, holding approximately 8.4% market share in 2023[47] - Revenue contributions by region showed Southeast Asia accounting for approximately 32.6%, with China and Taiwan contributing about 28.9% and 20.1% respectively[48] - The global semiconductor market is expected to experience significant expansion driven by increased demand in China and advancements in AI technology[52] - The board anticipates that the semiconductor industry has reached a cyclical low and is on the verge of a new growth phase[52] - The company is implementing automation in its production facilities to increase productivity and efficiency, ensuring a competitive edge in the market[52] Employee and Administrative Costs - The total employee costs for the six months ended June 30, 2024, were HKD 32,584,000, compared to HKD 29,186,000 in the same period of 2023, reflecting an increase of approximately 8.2%[24] - Administrative expenses increased by approximately 11.3% to HKD 13.9 million, up from HKD 12.5 million in the same period last year, primarily due to increased consulting fees related to factory renovations[58] Shareholder and Dividend Information - The company declared an interim dividend of HKD 0.33 per share, totaling HKD 11,220,000, with HKD 5,778,000 payable to a major shareholder offset against amounts receivable[28] - The company does not plan to declare an interim dividend for the six months ending June 30, 2024[75] Compliance and Governance - The company has established an Audit Committee consisting of three independent non-executive directors[80] - The external auditor, Dahuama Shiyun CPA, has reviewed the unaudited consolidated financial statements and found no issues[80] - The Audit Committee and management have reviewed the unaudited consolidated performance and confirmed compliance with applicable accounting standards and GEM listing rules[80] - The interim report for the six months ending June 30, 2024, will be published on the company's and the Hong Kong Stock Exchange's websites[81] - The announcement regarding the interim results will be sent to shareholders as per GEM listing rules[81]
优博控股(08529) - 2024 - 中期业绩