Financial Performance - The company's operating revenue for the first half of 2023 was ¥846,898,078.24, a decrease of 9.47% compared to ¥935,491,902.32 in the same period last year[24]. - The net profit attributable to shareholders was ¥46,164,533.23, down 40.96% from ¥78,192,246.22 year-on-year[24]. - The net cash flow from operating activities was ¥26,419,098.61, a significant decline of 69.08% compared to ¥85,454,415.52 in the previous year[24]. - Basic and diluted earnings per share were both ¥0.12, representing a decrease of 42.86% from ¥0.21 in the same period last year[24]. - The total revenue for the reporting period was ¥846,898,078.24, a decrease of 9.47% compared to ¥935,491,902.32 in the same period last year[45]. - The cost of goods sold was ¥722,041,807.48, down 4.70% from ¥757,676,356.27 year-over-year[45]. - Research and development expenses decreased by 6.35% to ¥33,371,403.92 from ¥35,633,080.72 in the previous year[45]. - The company reported a total profit of ¥44,784,834.00 for the first half of 2023, down from ¥90,937,501.65 in the first half of 2022[142]. - The total comprehensive income for the first half of 2023 was reported at 3,912 million yuan, indicating robust operational performance[162]. Assets and Liabilities - Total assets at the end of the reporting period reached ¥2,324,225,244.88, an increase of 21.87% from ¥1,907,174,359.61 at the end of the previous year[24]. - The total liabilities reached CNY 1,063,356,152.59, up from CNY 681,228,717.03, marking a growth of approximately 56%[134]. - Current liabilities rose to CNY 992,621,115.99, compared to CNY 542,425,807.24 at the start of the year, indicating an increase of about 83%[134]. - The total equity attributable to shareholders increased to CNY 1,260,869,092.29 from CNY 1,225,945,642.58, reflecting a growth of about 3%[134]. - The cash and cash equivalents decreased to ¥221,984,133.29, down 3.93% from ¥257,017,034.40 at the end of the previous year[53]. Market and Industry Trends - The semiconductor packaging industry in China is experiencing a downturn, with a decline in demand for packaging materials in the first half of 2023, continuing the trend from 2022[32]. - The semiconductor packaging materials market is expected to recover as the industry adapts to changing demands and technological advancements[32]. - The company specializes in the development, production, and sales of semiconductor packaging materials, including lead frames and bonding wires, with no significant changes in its main business since establishment[33]. Research and Development - The company has a strong R&D capability, with 126 R&D personnel and a total of 142 patents, including 43 invention patents and 99 utility model patents[39]. - The company plans to enhance its overseas market development while continuing to expand its domestic market presence[39]. - The company aims to adjust its product structure and accelerate technological innovation to mitigate risks associated with market volatility[67]. Environmental and Social Responsibility - The company has achieved an 80% online reuse rate for electroplating wastewater, demonstrating its commitment to clean production and environmental sustainability[42]. - The company is committed to reducing carbon emissions and has implemented measures such as optimizing energy consumption and promoting a digital factory project[82]. - The company donated 30,000 yuan to the "Heart" Hope Rescue Fund in Yanyuan County to support poverty alleviation and rural revitalization efforts[84]. Risk Management - The company has identified potential risks and has outlined corresponding measures in its report[5]. - The company faces risks from fluctuations in raw material prices, particularly for copper, gold, and silver, which significantly impact cost control[68]. - The company has implemented risk mitigation strategies for raw material price volatility, including zero inventory for key materials and centralized procurement[68]. Shareholder Information - The company plans not to distribute cash dividends or issue bonus shares[6]. - The total number of ordinary shares at the end of the reporting period is 375,284,000, representing 100% of the shares[117]. - The largest shareholder, Ningbo Pulisai Electronic Co., Ltd., holds 19.72% of the shares, totaling 74,009,200 shares, which are currently frozen[118]. Corporate Governance - The company has established a multi-tier governance structure, including a board of directors and various specialized committees[171]. - The company adheres to the accounting standards set by the Ministry of Finance, ensuring that financial statements reflect its financial status, operating results, and cash flows accurately[171]. - The company has established a comprehensive risk management system for its hedging activities, ensuring compliance with relevant laws and regulations[61].
康强电子(002119) - 2023 Q2 - 季度财报