Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry

Core Insights - Synopsys, Inc. has launched a production-ready multi-die reference flow utilizing Synopsys.ai™ EDA suite and Synopsys IP for Intel Foundry's EMIB advanced packaging technology, aimed at enhancing the design and analysis of multi-die architectures [2][6] - The solution facilitates a comprehensive approach to address thermal, signal integrity, and interconnect challenges, enabling efficient die-package co-design and improved manufacturing reliability [3][6] - The integration of Synopsys 3DIC Compiler with Ansys® RedHawk-SC Electrothermal™ technology enhances power and thermal signoff for 2.5D/3D multi-die designs, maximizing system performance [3][6] Multi-Die Solution Features - The multi-die solution supports early architecture exploration, rapid software development, and system validation, providing a scalable framework for heterogeneous integration [3][7] - Synopsys 3DSO.ai, an AI-driven optimization engine, is integrated to improve productivity and system performance for 2.5D and 3D multi-die designs [2][3] - The solution is designed to meet the increasing bandwidth demands for AI and high-performance computing applications, allowing for the development of billion- to trillion-transistor multi-die systems [7][9] Performance Improvements - The combination of Synopsys IP and Synopsys 3DIC Compiler can lead to a 30% reduction in effort and a 15% improvement in quality of results compared to traditional manual flows, achieved through automation of routing and signal integrity analysis [9][11] - The reference flow is currently available from both Intel Foundry and Synopsys, providing immediate access to advanced design capabilities [9]