Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm for AI/ML and Video Solutions at the Edge

Core Insights - Lantronix Inc. has launched new System-in-Package (SiP) solutions powered by Qualcomm Technologies' chipsets, enhancing its position in industrial and enterprise IoT innovation with advanced AI and ML capabilities at the edge [1][2][3] Product Offerings - The new SiP families include five distinct series designed for various applications such as robotics, industrial automation, video surveillance, and drones, emphasizing performance and cost efficiency [2][3] - The IQ9 Series SiPs provide robust computing for autonomous devices, featuring safety functions, fault tolerance, and support for multiple cameras, enhancing robot perception and navigation [5] - The Open-Q 8550CS family focuses on advanced video and AI applications, offering high AI performance and connectivity options, suitable for demanding edge computing tasks [7][8] - The Open-Q 6490CS and 5430CS families allow for scalable AI solutions with low-power performance and advanced multimedia capabilities, supporting multiple camera streams for video-intensive applications [9] Strategic Collaboration - Lantronix has maintained a strong partnership with Qualcomm Technologies for over 15 years, leveraging Qualcomm's processors to deliver reliable, industrial-grade systems that facilitate the deployment of AI solutions at the edge [2][3] Technological Advancements - The Qualcomm AI Hub integrated into Lantronix's SiP solutions provides access to over 100 AI models and optimizes AI capabilities, achieving performance metrics ranging from 3.5 to 100 INT-8 TOPS [4]