ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool for Front-End Semiconductor Manufacturing

Core Insights - ACM Research, Inc. announced a significant performance breakthrough for its Ultra C Tahoe Cleaning tool, aimed at meeting the technical requirements of advanced semiconductor nodes [1][2] Product Performance - The Ultra C Tahoe now matches the performance of standalone single-wafer cleaning tools for low-to-medium temperature sulfuric peroxide mix (SPM) processes, utilizing a patented hybrid architecture that combines batch wafer processing and single wafer cleaning [2][4] - The tool achieves an average particle count of less than 6 particles at 26nm, suitable for advanced node manufacturing, and can remove 1x nm particles for high-end applications [5] Environmental and Cost Efficiency - The Ultra C Tahoe offers up to 75% reduction in sulfuric acid consumption, leading to estimated annual cost savings of up to $500,000 from sulfuric acid alone, along with additional environmental benefits [2][5] - The tool aligns with sustainability goals, reducing costs for high-volume manufacturers [5] Market Positioning - The Ultra C Tahoe is positioned to capture market share in the SPM market, particularly in middle and low-temperature applications, which represent an estimated 20% of the total clean market [4] - The upgraded tool is currently in production at several high-volume customer facilities in mainland China, with additional customers evaluating the technology [4] Technological Advancements - The upgraded Ultra C Tahoe features a 25-slot bench module and nine single-wafer chambers, delivering throughput exceeding 200 wafers per hour, comparable to a 12-chamber SPM system [5] - The tool includes advanced flexibility with optional configurations such as new jet spray technology and ACM's patented SAPS/TEBO technologies [5]