Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing

Core Insights - Applied Materials is expanding its EPIC innovation platform to accelerate the commercialization of advanced chip packaging technologies [1][4] - The semiconductor industry is experiencing growth due to the rise in connected devices and AI, but faces challenges related to energy consumption [2][3] - Advanced packaging technologies are essential for improving energy efficiency in AI chips, with a focus on collaboration among industry leaders [3][4] Industry Overview - The chip industry is witnessing tremendous growth opportunities driven by the increase in connected devices and AI [2] - Energy consumption is a significant challenge, necessitating advanced packaging and heterogeneous integration to enhance system performance [2][3] Company Strategy - The EPIC Advanced Packaging strategy aims to foster co-innovation and improve the development and commercialization of foundational packaging technologies [4] - Applied Materials is leveraging a global network of innovation centers to provide early access to next-generation technologies for chipmakers and system designers [4][5] Collaboration and Summit - A summit was held in Singapore, bringing together over two dozen R&D leaders from various semiconductor companies and research institutions to discuss advancements in chip packaging [1][6] - Participants included major companies like AMD, Intel, and TSMC, as well as institutions like the National University of Singapore [6] Technological Focus - Advanced packaging technologies such as micro-bumps, through-silicon vias (TSVs), and silicon interposers are critical for the next generation of AI chips [3] - The industry is developing new packaging building blocks to enhance interconnect density and bandwidth [3]