ISSCC 2025：中国入选论文，全球第一

ISSCC 2025 Overview - ISSCC 2025 will be held in San Francisco from February 16-20, 2025, and is recognized as the most prestigious international conference in the semiconductor and integrated circuits field, often referred to as the "Olympics of Chips" [2] - The ISSCC 2025 China launch event took place in Hefei on November 25, 2024, highlighting the importance of global collaboration in advancing integrated circuit technology [3] Global Paper Submission and Acceptance - ISSCC 2025 received a record 914 paper submissions, a 4.7% increase from ISSCC 2024's 873 submissions [4] - 246 papers were accepted from 96 institutions across 14 countries, with universities contributing 78.5% of the accepted papers, followed by industry at 19.5% and research institutions at 2% [4] - The acceptance rate for ISSCC 2025 was 26.9%, slightly higher than the 26.8% acceptance rate in ISSCC 2024 [6] Regional and Institutional Contributions - The Far East region dominated with 165 accepted papers, including 86 from China, 49 from South Korea, and 11 from Japan [7] - Peking University led globally with 15 accepted papers, followed by the University of Macau with 14 and Tsinghua University with 13 [7] - China (including Mainland, Hong Kong, Macau, and Taiwan) maintained its top position with 112 accepted papers, up from 86 in ISSCC 2024 [7] - Mainland China alone contributed 76 papers, a significant increase from 55 in ISSCC 2024, representing 37.4% of the total accepted papers [7] Key Highlights from China - China's research in integrated circuits has gained international recognition, with 15 out of 57 highlighted papers coming from Mainland China [14] - In the hardware security field, Tsinghua University's Professor Liu Leibao's team was the only Mainland Chinese team to have a paper accepted for the second consecutive year [14] - In the RF circuit field, Mainland China contributed 13 papers, with 2 being highlighted, including a GaN power amplifier from Tsinghua University achieving over 38% efficiency [26][27] - In the analog circuit field, Mainland China contributed 10 papers, with 2 highlighted papers from Zhejiang University and Tsinghua University [28][31][33] - In the digital circuit and architecture field, Mainland China contributed 4 papers, with Tsinghua University's paper on a 3D GS processor being highlighted [35][37] - In the AI accelerator field, Tsinghua University's paper on a large language model accelerator achieved 88.36 TOPS/W efficiency [41] - In the wired communication field, Mainland China contributed 9 out of 19 papers, dominating the high-speed and high-density D2D communication sectors [42] - In the power management field, Mainland China contributed 8 papers, with the University of Macau contributing 7 papers, including 3 highlighted papers [45] - In the wireless communication field, Mainland China contributed 8 papers, with Tianjin University and Fudan University's papers being highlighted [47][49][51] - In the data converter field, Mainland China contributed 10 out of 16 papers, with 4 highlighted papers from Tsinghua University, Peking University, and the University of Macau [52][54][55] - In the memory field, Mainland China contributed 5 papers, with 3 from Southeast University and 1 each from Tsinghua University and the Chinese Academy of Sciences [58] Trends and Innovations - The ISSCC 2025 highlighted trends in energy-efficient precision, bandwidth-power efficiency, and temperature stability in analog circuits [30][31] - In the hardware security field, there is a shift from symmetric-key encryption to asymmetric-key encryption and privacy-enhancing technologies [18] - In the RF circuit field, advancements in GaN power amplifiers and solid-state power amplifiers were notable [26][27] - In the AI accelerator field, innovations in large language model accelerators and generative AI processors were highlighted [41][40] - In the memory field, the demand for high-speed, high-density, and low-power memory is growing due to advancements in deep learning and AI [59]