Axcelis(ACLS) Prnewswire·2024-12-03 13:00Core Insights - Axcelis Technologies, Inc. will showcase its Purion™ and GSD Ovation™ Series of ion implanters at SEMICON Japan 2024, highlighting its role as a leading supplier in the semiconductor industry [1][2] Product Offerings - Purion Power Series™ is designed for thin silicon, TAIKO, and silicon carbide (SiC) wafer processing, supporting 150mm, 200mm, and 300mm wafers [3] - Purion H™ Series provides unmatched purity and precision with industry-leading productivity for high current applications [3] - Purion H200™ is a high current medium energy implanter tailored for IoT and power applications [3] - Purion XE™ Series is the leading high energy implant platform, featuring the Purion XEmax model with Boost Technology™ for advanced image sensor applications up to 15MeV [3] - Purion M™ Series offers low power consumption and a broad range of mid-current doses, providing flexibility for evolving implant requirements [3] - GSD Ovation™ is a cost-effective solution for extending high current and high energy batch platform capabilities, supporting wafer splitting and alternate substrates [3] Event Highlights - Axcelis will host a session on SiC Power Device Manufacturing Ion Implant Technology on December 12, focusing on the transition from 150mm to 200mm SiC wafers and the flexibility required for various wafer sizes and substrate types [4] - A Happy Hour Celebration will take place on December 12, providing an opportunity for attendees to meet the Axcelis team [4] Company Overview - Axcelis has over 45 years of experience in providing innovative, high-productivity solutions for the semiconductor industry, focusing on ion implantation systems [5]