Zheng Quan Shi Bao Wang·2024-12-04 00:36Core Viewpoint - The report from CITIC Securities indicates that the 1.6T optical module is entering a mass production phase, with accelerated penetration of new technologies such as silicon photonics and Co-Packaged Optics (CPO) Group 1: Technology and Market Trends - The demand for computing in the artificial intelligence sector is growing exponentially, necessitating accelerated training and inference capabilities as stated by NVIDIA [1] - The 1.6T optical module is expected to begin small-scale shipments by the end of 2024, approximately one year earlier than previously anticipated [2] - The overseas giants investing in silicon photonics technology are likely to experience rapid growth amid the AI wave [3] Group 2: Industry Structure and Demand - There is strong downstream demand for silicon photonics technology, with diverse upstream design solutions and active engagement from foundries [4] - Co-Packaged Optics (CPO) is recognized as a mainstream product form for future high-speed optical communication, significantly reducing power consumption and costs for switches [5] - The rapid development of AI and the increase in parameters for multimodal large models are expanding bandwidth capacity, including within servers or cabinets [6] Group 3: Market Opportunities - The increase in CPO penetration is expected to lead to substantial growth in the market size of the optical communication sector [7] - Domestic optical module manufacturers are leading in strength and are actively participating in the overseas computing power chain, with performance already reflecting high growth [8] - In addition to optical module manufacturers, more A-share listed companies are actively engaging in overseas computing power layouts, including liquid cooling, copper connections, and power supply segments [6]