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GMG's THERMAL-XR(R) Demonstrates Potential for Electronics Heat Sink Miniaturization and Efficiency
RyderRyder(US:R) Newsfile·2024-12-11 13:15

Core Viewpoint - Graphene Manufacturing Group Ltd. (GMG) is advancing the commercialization of its THERMAL-XR® product, which enhances heat sink efficiency in electronics, enabling significant size reduction while maintaining thermal performance [1][7]. Customer Engagement Update - GMG is actively testing THERMAL-XR® with various companies across multiple industries, particularly for use in heat sinks for electronics [2]. Heat Sink Miniaturization - Third-party modeling indicates that applying THERMAL-XR® can reduce heat sink size by up to 39% while maintaining equivalent thermal performance, leading to potential savings in weight and material costs [3][6]. - A heat sink coated with THERMAL-XR® reaches a maximum temperature of 62 degrees Celsius, which is 23% lower than the 80 degrees Celsius maximum of an uncoated heat sink of the same size [3][4]. Market Potential - Global PCB production is projected to reach 530 million square meters annually by 2030, with an expected 5.2 billion units requiring heat sinks for cooling [6]. - If 0.1% of these applications utilize THERMAL-XR®, approximately 26.5 million liters of the coating could be used annually by 2030 [6]. Company Objectives - GMG's critical business objectives include producing graphene, building revenue from energy savings products, developing next-generation batteries, and enhancing supply chain and project execution capabilities [11][13]. Product Overview - THERMAL-XR® is a unique coating system that improves thermal heat transfer on heat exchange surfaces, leveraging the properties of GMG Graphene to enhance efficiency and potentially reduce power consumption [8][9].