YES RapidCure Systems chosen by SkyWater Technology for Fan Out Wafer Level Packaging

The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of UV and direct thermal exposure that significantly reduces process cycle time. FREMONT, Calif., Dec. 16, 2024 /PRNewswire/ -- YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging today announced that SkyWater Technology (NASDAQ: SKYT), has chosen the YES RapidCure polymer dielectric curing systems for their implementation of ...