Core Viewpoint - The successful launch of the diamond semiconductor high-power heat sink project marks a significant milestone for the company and represents a strategic move to expand into new markets and develop new growth avenues [1][2]. Group 1: Project Overview - The diamond semiconductor high-power heat sink project was officially completed and put into production on January 15, 2025, after over a year of preparation and construction [1]. - The project is a collaboration between the company and Taiwan's Jieshao Enterprise, focusing on advanced diamond functional materials to enhance innovation and technological capabilities in the diamond functional materials sector [1]. Group 2: Technological Focus - The project features a high-standard diamond semiconductor research and development center equipped with advanced international equipment, specifically aimed at developing large-sized high-power diamond heat sinks [1]. - Diamond is identified as the ideal material for high-power semiconductor heat dissipation due to its excellent thermal conductivity and various superior properties [1]. Group 3: Future Outlook - The company plans to continue expanding the functional applications of diamond in various fields such as sound, light, electricity, heat, and magnetism, contributing to breakthroughs in critical strategic materials for the nation [2]. - The successful production of this project is seen as a key step in the company's future industrial layout and a significant initiative to open up new spaces for development [2].
力量钻石：半导体高功率散热片金刚石功能材料研发制造项目建成投产