GlobalFoundries Announces New York Advanced Packaging and Photonics Center

Company Announcement - GlobalFoundries (GF) plans to establish a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility [1] - The center aims to enable semiconductors to be securely manufactured, processed, packaged, and tested entirely onshore in the U.S., addressing demand for silicon photonics and other essential chips in AI, automotive, aerospace, defense, and communications [1] - GF's New York Advanced Packaging and Photonics Center will expand advanced packaging capabilities, providing an end-to-end U.S.-based solution for chips made at GF's New York facility [3] Industry Trends - Growth in AI is driving adoption of silicon photonics and 3D/heterogeneously integrated (HI) chips to meet power, bandwidth, and density requirements in datacenters and edge devices [2] - Silicon photonics chips are positioned to address power and performance needs in automotive, communications, radar, and critical infrastructure applications [2] Investment and Job Creation - GF's total investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million in R&D over the next 10+ years [4] - The project is expected to create approximately 100 new full-time GF jobs in New York over the next five years [4] - New York state will provide up to $20 million in new support, in addition to the previously announced $550 million from the New York State Green CHIPS program [5] - The U.S. Department of Commerce will provide up to $75 million in direct funding, supplementing the previously announced GF award under the CHIPS and Science Act [5] GF's New York Facility - GF employs approximately 2,500 people at its Malta, New York fab and has invested over $16 billion in the facility since its opening in 2011 [6] - The New York fab has Trusted Foundry accreditation and manufactures secure chips in partnership with the U.S. government [6] Advanced Packaging Capabilities - The center will offer advanced packaging, assembly, and testing for GF's silicon photonics platform, integrating optical and electrical components on a single chip for power efficiency and performance [8] - It will provide full turnkey advanced packaging, bump, assembly, and testing for aerospace and defense customers under GF's Trusted Foundry accreditation, ensuring chips for sensitive national security systems never leave the U.S. during production [8] - New production capabilities will include advanced packaging, wafer-to-wafer bonding, assembly, and testing of 3D and HI chips using GF's 12LP+, 22FDX®, and other leading platforms [8]