瑞丰光电首推金刚石基超大功率密度封装新品

Group 1 - The core viewpoint of the article highlights that Ruifeng Optoelectronics has introduced a groundbreaking high-power packaging product using diamond substrate technology, addressing the pain points of traditional high-power packaging products [1] - The new diamond-based ultra-high power density packaging meets the demands for high-power LEDs in various applications such as automotive headlights, outdoor high-intensity lighting, and stage lighting [1] - This innovation opens up more possibilities for the development and application of high-power LEDs in the industry [1]