Core Insights - ACM Research, Inc. has qualified its Single-Wafer High-Temperature Sulfuric Peroxide Mixture (SPM) tool with a key logic device manufacturer in mainland China, expanding its customer base to thirteen [1] - The Single-Wafer Moderate/High-Temperature SPM tool is designed for high-volume 300mm semiconductor manufacturing and addresses the growing demand for high-temperature sulfuric acid processing [2] - The tool supports various cleaning processes at temperatures ranging from 90°C to 190°C, catering to the evolving needs of the semiconductor industry [2][3] Product Features - The Single-Wafer Moderate/High-Temperature SPM tool features an inline chemical mixing system, a configurable process chamber, and can integrate with ACM's patented SAPS and TEBO technologies for enhanced cleaning [2] - It is compatible with wafer sizes from 150mm to 300mm and includes a multifunctional chemical distribution system and a self-cleaning chamber [3] - The nozzle design prevents acid mist splatter, improving particle performance and reducing maintenance frequency [1][5] Market Position - The Moderate/High-Temperature SPM tool represents a growing segment of the wafer-cleaning equipment market, essential for next-generation semiconductor device manufacturing [2] - ACM's innovative design positions the company to meet stringent industry requirements for particle control and chamber environment management as semiconductor process nodes advance [2]
ACM Research Announces Qualification of High-Temperature SPM Tool for Customer in China