Lantronix(LTRX) GlobeNewswire·2025-03-04 12:00Core Insights - Lantronix Inc. has made significant advancements in AI-driven camera technology by integrating its Open-Q SoM with Teledyne FLIR's infrared thermal imaging modules and Prism embedded software, enhancing the development of next-generation AI-driven camera solutions for autonomous navigation, drones, surveillance, and robotics [1][2][3] Company Overview - Lantronix is a global leader in IoT solutions focused on computing and connectivity, empowering AI edge intelligence, and providing customizable solutions for high-growth markets such as smart cities, enterprise, and transportation [8] Technology Integration - The integration of Lantronix's Open-Q SoM with Qualcomm's Dragonwing QRB5165 and QCS8250 processor platforms offers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging, and real-time decision-making [2][4] - The collaboration with Teledyne FLIR allows for advanced thermal imaging signal processing and AI functionalities, providing developers with greater flexibility in creating thermal imaging AI platforms [4][5] Product Features - The Open-Q 5165 SoM is ultra-compact (50mm x 29mm), production-ready, and pre-certified, optimized for AI and edge computing, featuring advanced capabilities such as super-resolution, turbulence suppression, atmospheric obscuration correction, noise reduction, image fusion, electronic stabilization, and local contrast enhancement [5][6] - The system supports multiple camera interfaces for simultaneous capture of color and infrared video, enhancing the performance of AI camera solutions [4][5] Upcoming Events - Lantronix will showcase its SoM at the Embedded World exhibition in Nuremberg, Germany, from March 13 to 15, 2025, at Qualcomm Technologies' booth [7]