Tower Semiconductor to Showcase its Next-Generation BCD Technology at APEC 2025

Core Insights - Tower Semiconductor is participating in the 2025 Applied Power Electronics Conference (APEC) to showcase its advanced power management technology platform, particularly its 300mm 65nm 3.3V-based BCD solution aimed at Automotive, AI, Mobile PMIC, and Data Center applications [1][2]. Company Overview - Tower Semiconductor is a leading foundry specializing in high-value analog semiconductor solutions, providing technology and process platforms for various markets including consumer, industrial, automotive, mobile, infrastructure, medical, and aerospace and defense [4]. - The company offers a wide range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensors, and integrated power management solutions [4]. - Tower Semiconductor operates multiple facilities globally, including one in Israel, two in the U.S., and two in Japan, along with shared and accessed capacities in Italy and New Mexico [4]. Product Innovations - The company’s BCD platforms, including the 0.18μm (200mm) and 65nm (300mm) technologies, are designed for various applications such as driver ICs, battery management, and high-voltage gate drivers, enhancing power efficiency across sectors [2]. - Tower's recent advancements include a 3.3V gate oxide technology that supports both 3.3V and 5V-based solutions, along with a comprehensive suite of design enablement tools [2]. Event Participation - Dr. Mete Erturk, Sr. Director of Power Management Marketing, will present on Tower Semiconductor's BCD Technology Foundry Offerings at APEC 2025 on March 19, 2025 [3].