Core Insights - Smartkem is set to unveil its MicroLED-in-a-Package (MiP) backlight technology at the Touch Taiwan conference, which could significantly impact the global display market [1][2] - The MiP technology utilizes a 'chip-first' MicroLED architecture that simplifies production and enhances display performance, targeting the LCD market, which constitutes approximately 65% of the global display industry [2][3] Company Overview - Smartkem aims to revolutionize the electronics sector with its advanced transistor technology and proprietary semiconductor materials, which are compatible with existing manufacturing processes [5][7] - The company has developed a proprietary Redistribution Layer (RDL) material that interconnects MicroLEDs to form a high-voltage chip, known as MiP4, designed to replace MiniLED packages in LCD backlights [4][6] Technology and Innovation - The MiP technology promises higher brightness at lower power consumption, reduced production costs, and compatibility with existing MiniLED die bonding equipment [6] - Smartkem's TRUFLEX® semiconductor technology enables low-temperature printing processes, which can lead to cost-effective, high-performance displays across various technologies, including MicroLED, MiniLED, and AMOLED [5][7] Event Details - The keynote presentation by Smartkem's Chairman and CEO, Ian Jenks, will take place on April 16, 2025, at the Touch Taiwan conference, highlighting the potential of the MiP backlight technology [2][3]
Smartkem To Unveil First Demo of a MicroLED-in-a-Package (MiP) Backlight at Touch Taiwan 2025