New power management chips from TI maximize protection, density and efficiency for modern data centers

Core Insights - Texas Instruments (TI) has launched new power-management chips to address the increasing power demands of modern data centers, particularly driven by high-performance computing and artificial intelligence (AI) [1][3] - The TPS1685 is introduced as the industry's first 48V integrated hot-swap eFuse with power-path protection, aimed at enhancing efficiency and scalability in data center designs [1][4] - TI also unveiled a new family of integrated GaN power stages, which are designed to improve power density and efficiency while simplifying the design process for data center hardware [1][5] Product Innovations - The TPS1685 hot-swap eFuse supports power levels beyond 6kW and is designed to simplify data center designs while reducing solution size by half compared to existing hot-swap controllers [4][7] - The new GaN power stages (LMG3650R035, LMG3650R070, LMG3650R025) achieve over 98% efficiency and high power density exceeding 100W/in³, integrating advanced protection features [6][7] - These innovations are showcased at the 2025 Applied Power Electronics Conference (APEC), highlighting TI's commitment to enhancing power management solutions [1][7] Industry Impact - The shift to 48V power architectures in data centers is becoming more prevalent as designers seek enhanced efficiency and scalability for components like CPUs and AI hardware accelerators [4][6] - TI's advancements in power-management technology are positioned to help data centers reduce their environmental footprint while meeting the growing energy demands of the digital world [3][4] - Collaborations with companies like Dell and Vertiv demonstrate the practical applications of TI's GaN technology in high-efficiency power supply units [8][9]