高阶产品销量快速提升 联瑞新材去年净利润同比增长44.47%

Core Viewpoint - Lianrui New Materials reported a significant increase in net profit and revenue for the year 2024, driven by the rising demand for high-performance packaging materials in the semiconductor market [1][2]. Financial Performance - The company achieved an operating income of 960 million yuan, representing a year-on-year growth of 34.94% [1]. - The net profit attributable to shareholders reached 251 million yuan, up 44.47% year-on-year [1]. - The non-recurring net profit attributable to shareholders was 227 million yuan, reflecting a 51% increase compared to the previous year [1]. Market Trends - The semiconductor market is entering an upward cycle, with a projected sales increase of 19.1% in 2024 compared to 2023, driven by advancements in AI and other application technologies [2]. - There is a notable shift from traditional packaging to advanced packaging in the semiconductor industry, with increasing demand for advanced packaging materials [3]. Product Development and Strategy - The company is focusing on high-growth areas such as heterogeneous integration advanced packaging and high-frequency, high-speed copper-clad laminates, continuously launching various specifications of advanced materials [2][4]. - Lianrui New Materials plans to enhance its product structure by investing in the development of next-generation products, including high-performance spherical silica and other advanced materials [4][5]. - The company is investing approximately 300 million yuan in a project to build high-performance ultra-pure spherical powder materials for advanced packaging, which is expected to expand its production scale and strengthen its market position [4][5]. Future Outlook - The company aims to penetrate global markets deeply, focusing on semiconductor packaging, AI computing devices, and high thermal conductivity materials, with a strategy centered around "five firsts" to enhance market share [3]. - The demand for functional inorganic non-metallic materials is expected to grow rapidly, driven by advancements in high-speed communication, servers, consumer electronics, and automotive electronics [3].