脑机接口、AI底座，多项“首创”硬科技亮相中关村

Group 1: DPU and AI Infrastructure - The Data Processing Unit (DPU) is recognized as the "third main chip" following CPU and GPU, with the latest third-generation DPU chip K2-Pro showcased at the Zhongguancun Forum [3] - The K2-Pro chip is designed to address challenges in large-scale data centers, achieving network throughput of 25G and 100G, filling a gap in the high-performance network card market [3] - The rapid development of AI, 5G, and the metaverse necessitates innovative computing solutions, with heterogeneous computing (DPU + CPU + GPU) becoming mainstream for next-generation intelligent computing centers [3] Group 2: AI Industry Development - The "Artificial Intelligence +" exhibition area highlighted the importance of autonomous innovation in computing infrastructure for AI industry growth, featuring products from GPU company Moore Threads [4] - The "Kua'e" system-level computing solution is tailored for large model training and inference, meeting the core demands of the large model era [4] - The Beijing Digital Economy Computing Power Center, a key project, integrates thousands of P-level domestic computing resources and provides various services for AI industry development [6] Group 3: Medical Innovations - The first non-invasive multi-channel brain oxygen monitoring device developed by Zhongke Boyue can monitor eight brain regions and is expected to enter clinical use in 2026 [7] - The Lattice NEXT blood flow-directed mesh stent, developed by Aike Medical Devices, expands the treatment range for intracranial aneurysms and has been recognized as an innovative medical device [9]