Prnewswire·2025-04-23 20:00Core Insights - Ansys and TSMC have enhanced AI-assisted workflows for semiconductor design, focusing on RF design migration and photonic integrated circuits, which aim to optimize 3D integrated circuit design for AI and HPC applications [2][9] - The collaboration includes new certifications for Ansys' semiconductor solutions, particularly for TSMC's advanced A16 technology and the newly announced N3C technology [2][3][9] AI-Assisted Workflows - Ansys has introduced AI-assisted photonic design optimization solutions that leverage its optiSLang process integration and design optimization software, enhancing the performance of photonic integrated circuits [6] - The AI-assisted RF design migration flow combines Ansys HFSS-IC Pro with Synopsys tools, automating device placement and routing optimization while maintaining design intent and performance [7] Certification and Technology Advancements - Ansys' RedHawk-SC, RedHawk-SC Electrothermal, and Totem platforms are certified for TSMC's A16 process, ensuring reliable thermal management and electromigration analysis [3][4][9] - The new HFSS-IC product family, certified for TSMC's 5nm and 3nm processes, meets the accuracy requirements for next-generation semiconductor products [5][9] Multiphysics Analysis - A joint multiphysics signoff analysis flow has been established, integrating Ansys and Synopsys tools for comprehensive extraction, timing, power, EM/IR, and thermal analysis [10] - This multiphysics approach supports thermal-aware and voltage-aware timing analysis, facilitating the convergence of large 3D-IC designs [10] Industry Impact - The collaboration between Ansys, TSMC, and Synopsys is driving innovation in 3D-IC design, improving chip reliability and addressing the challenges posed by shrinking chip sizes and increasing energy efficiency demands [11] - AI-driven solutions are significantly enhancing productivity in designing 3D-IC components, providing automation for essential tasks [11]