ROHM Develops New High Power Density SiC Power Modules

Compact high heat dissipation design sets a new standard for OBCs ROHM's new 4-in-1 and 6-in-1 SiC Molded Modules in the HSDIP20 Package Optimized for PFC and LLC converters in onboard chargers for xEVs ROHM's Top-Side Cooled Discretes and HSDIP20 in PFC Circuits HSDIP20 achieves high power density due to excellent heat dissipation performance Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded mod ...