全额减免相关费用

Group 1 - The People's Bank of China and the China Securities Regulatory Commission jointly announced measures to support the issuance of technology innovation bonds, aiming to enrich the product system and improve the supporting mechanisms for these bonds [1] - The National Interbank Funding Center announced a full waiver of transaction fees for technology innovation bonds in the interbank bond market from 2025 to 2027 [1] - The Central Clearing Company will waive service fees for the issuance of technology innovation special financial bonds from January 1, 2025, to December 31, 2027, and will refund any fees already paid for applicable services [3] Group 2 - The Interbank Market Clearing House will also fully waive interest payment and redemption service fees for issuers of technology innovation bonds starting from May 7, 2025, for an initial period of two years [4] - The Shanghai, Shenzhen, and Beijing Stock Exchanges will reduce transaction settlement costs for technology innovation bonds and continue to waive various fees related to issuance and trading [7] - The announcement encourages local governments to establish risk compensation funds or other supportive measures to provide interest subsidies and government financing guarantees for technology innovation bonds [7]