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【新华解读】债券支持科创融资持续发力 创新增量措施细则“呼之欲出”
Xin Hua Cai Jing·2025-05-07 16:48

Core Viewpoint - The Chinese government is implementing new monetary policy tools to support technology innovation, including the establishment of a risk-sharing mechanism for technology innovation bonds, which is expected to significantly impact the development of the technology innovation sector in China [1][4]. Group 1: Policy Initiatives - The People's Bank of China (PBOC) and other government departments have introduced multiple policies since 2024 to enhance financing support for technology innovation enterprises, creating a more diversified financing mechanism [2]. - A notable initiative includes the creation of a "technology board" in the bond market, aimed at improving the issuance and trading of technology innovation bonds, thereby lowering issuance costs and facilitating capital flow into the technology sector [4][6]. Group 2: Financial Instruments and Market Trends - As of the end of 2024, the outstanding scale of technology innovation bonds reached 1.6416 trillion yuan, accounting for 3.32% of China's credit bond market. In 2025, 405 technology innovation bonds were issued, totaling 372.756 billion yuan, representing a year-on-year growth of approximately 60% [6]. - The issuance of technology company bonds constituted 49.63% of the total in 2024, while technology notes and short-term financing bonds accounted for 21.11% and 25.35%, respectively, indicating a predominance of company bonds and notes in the current market [6]. Group 3: Expert Insights - Industry experts suggest that the new risk-sharing tools for technology innovation bonds will encourage the issuance of longer-term bonds, aligning with the long development cycles typical of technology research and development, thus avoiding the mismatch of short-term debt financing for long-term investments [5][7]. - The establishment of a comprehensive service system combining bond financing, credit support, and equity investment is expected to promote continuous innovation among enterprises [7].