本川智能拟发不超4.9亿可转债 2021上市即巅峰募6.2亿

Core Viewpoint - Benkwan Intelligent (300964) plans to issue convertible bonds to raise funds for various projects, including the construction of a smart circuit product production facility and a PCB production base in Thailand, as well as to supplement working capital [1][2]. Group 1: Convertible Bond Issuance - The convertible bonds will be issued at a face value of RMB 100.00 each, with a term of 6 years and an annual interest payment structure [1]. - The total amount to be raised from the bond issuance is capped at RMB 49 million, which will be allocated to specific projects and working capital [2][3]. - The initial conversion price for the bonds will be determined based on the average trading price of the company's A-shares over the 20 trading days prior to the announcement [2]. Group 2: Project Funding Allocation - The funds from the bond issuance will be allocated as follows: - Zhuhai Shuo Hong's smart circuit product production project: Total investment of RMB 35.62 million, with RMB 33.45 million from the bond proceeds [3]. - Benkwan Intelligent's PCB production base in Thailand: Total investment of RMB 23.76 million, with RMB 10.55 million from the bond proceeds [3]. - Supplementing working capital: RMB 5 million [3]. - The total investment for all projects amounts to RMB 64.38 million, with the bond proceeds covering RMB 49 million [3]. Group 3: Financial Performance - For the fiscal year 2024, the company reported a revenue of RMB 596.10 million, a year-on-year increase of 16.67% [5][6]. - The net profit attributable to shareholders reached RMB 23.74 million, reflecting a significant increase of 391.81% compared to the previous year [5][6]. - The net profit after excluding non-recurring gains and losses was RMB 16.97 million, up 351.81% year-on-year [5][6]. - The cash flow from operating activities was RMB 28.18 million, showing a decrease of 62.22% compared to the previous year [5][6].