债券市场“科技板”正式“开板”，中信银行牵头承销项目达9单

Group 1 - The bond market's "Technology Board" was officially launched on May 8, with the first batch of 15 national technology innovation bonds announced for issuance [1] - CITIC Bank acted as the lead underwriter for 9 of the 15 projects, demonstrating its significant role in this initiative [1] - The introduction of the "Technology Board" is seen as a major innovation in financial services for technological innovation, which is expected to profoundly reshape the domestic technology finance and capital market system [1]