深圳率先试点债券市场 “科技板” 两家企业成首批发行企业

Group 1 - The People's Bank of China and the China Securities Regulatory Commission jointly announced measures to support the issuance of technology innovation bonds, aiming to broaden financing channels for technology innovation enterprises and guide funds towards early, small, long-term, and hard technology investments [1] - The China Foreign Exchange Trade System announced the launch of technology innovation bonds in the interbank market, enhancing financial support for technology innovation [1] - Two Shenzhen companies, Luxshare Precision Industry Co., Ltd. and Shenzhen Investment Holdings Co., Ltd., are among the first to issue technology innovation bonds, each planning to raise 1 billion yuan for various purposes including optimizing debt structure and investing in early-stage technology enterprises [1] Group 2 - Shenzhen has proactively responded to central government calls by organizing discussions among over 20 technology companies and financial institutions to support the construction of a multi-level bond market [2] - The city has set a "four ones" goal to establish a working group, create a working mechanism, reserve quality projects, and gather capable intermediaries to encourage the issuance of the first batch of "technology board" bonds [2] - The local financial management bureau stated that Shenzhen will continue to improve the technology finance ecosystem to attract more participants in bond issuance, contributing to the national innovation-driven development strategy [2]