Huan Qiu Wang·2025-05-09 02:38Core Viewpoint - The People's Bank of China and the China Securities Regulatory Commission have jointly announced support for the issuance of technology innovation bonds by financial institutions, technology companies, private equity investment institutions, and venture capital institutions [1] Group 1: Issuance Response - Following the policy announcement, 36 companies have announced the issuance of technology innovation bonds with a total issuance scale of 21 billion yuan [3] - 14 companies have initiated registration with a total registered scale of 18 billion yuan [3] - 24 private equity investment institutions are expected to issue technology innovation bonds with an overall scale of nearly 10 billion yuan [3] Group 2: Financial Institutions' Plans - The China Development Bank plans to issue no more than 20 billion yuan in technology innovation bonds, divided into three varieties: 6 billion yuan for a 2-year term, 10 billion yuan for a 3-year term, and 4 billion yuan for a 182-day term [3] - Industrial and Commercial Bank of China plans to issue a base amount of 10 billion yuan, with an oversubscription of no more than 10 billion yuan [3] - Industrial Bank intends to issue 10 billion yuan [3] Group 3: Use of Proceeds - The funds raised from the issuance of technology innovation bonds by banks and other institutions will be used to support the development of technology innovation businesses [3] - The China Development Bank has stated that the raised funds will primarily be allocated to national technology innovation demonstration enterprises and manufacturing industry champions [3] Group 4: Private Equity Institutions - 14 private equity investment institutions, including Yuanhe Holdings and Luxin Venture Capital, have announced an expected issuance scale of 6 billion yuan [4] - 10 private equity investment institutions, such as Junlian Capital and Qiming Venture Partners, have entered the registration process [4]