首批36单科创债已公告发行规模达210亿元

Group 1 - The People's Bank of China and the China Securities Regulatory Commission have announced measures to support the issuance of technology innovation bonds, aiming to enrich the product system and improve the supporting mechanisms for these bonds [2] - The first batch of 36 technology innovation bonds has been announced with a total issuance scale of 21 billion yuan, involving 22 technology companies and 14 private equity investment institutions [3] - The bonds cover various emerging sectors such as integrated circuits, intelligent computing centers, and new materials, with participation from both state-owned and private enterprises [3] Group 2 - The technology innovation bonds are seen as a crucial link between the capital market and technological innovation, promoting high-quality economic development [1] - The initiative includes flexible bond terms, encouraging long-term bonds to better match the funding needs of the technology innovation sector [2] - The market response has been positive, with active participation in the registration and issuance of technology innovation bonds [2]