同宇新材深耕电子树脂领域 持续助力电子信息产业高质量发展

Core Insights - The importance of electronic resin as a fundamental material is increasing in the rapidly developing electronic information industry, with applications extending from smartphones to new energy vehicles [1] - Tongyu New Materials (Guangdong) Co., Ltd. has established itself as a significant player in the electronic resin field for copper-clad laminates through nearly a decade of focused investment in technology research and large-scale production [1][2] - The company has diversified its product range, including MDI modified epoxy resin, DOPO modified epoxy resin, high-bromine epoxy resin, BPA-type phenolic epoxy resin, and phosphorus-containing phenolic resin curing agents, providing systematic resin solutions for various needs [1] Industry Analysis - The global PCB (Printed Circuit Board) industry is experiencing steady growth driven by technological iterations in end applications such as 5G communication, consumer electronics, and automotive electronics, leading to a simultaneous increase in market demand for electronic resin [1] - Companies with technological accumulation and stable supply capabilities are better positioned to capitalize on this trend [1] Company Strategy - Tongyu New Materials has gradually transformed its investment in technology research and production processes into market competitiveness by integrating R&D resources and optimizing production workflows [2] - The company aims to continue focusing on technological innovation and service capability enhancement in the electronic resin field, strengthening collaboration with industry chain partners to promote product iteration and upgrade [2]