可年产超9亿颗“中国芯”！淮安清江浦多一座国家级实验室

Core Insights - The project in Huai'an's Qingjiangpu District focuses on high-end semiconductor chip packaging and testing, with significant construction progress and an expected operational date by the end of 2025 [3][5]. Project Overview - The first phase of the project involves an investment of 1 billion yuan, covering an area of approximately 31 acres, and includes the construction of a modern intelligent factory and a 310 square meter Class A warehouse [3][5]. - The project aims to establish 15 semiconductor chip packaging lines and an accelerated life testing line, with plans to create a national-level integrated circuit product laboratory [3][5]. Production Capacity and Economic Impact - Once fully operational, the project is expected to achieve an annual packaging capacity of over 900 million semiconductor chips and generate annual sales of 1 billion yuan, creating 600 new jobs [3][5]. Industry Context - The semiconductor packaging and testing project aligns with national strategic emerging industries and is categorized as an encouraged sector under the revised industrial structure adjustment guidance [5]. - The project utilizes 28nm technology, which meets over 90% of domestic demand, offering high performance and cost-effectiveness [5]. Competitive Landscape - The domestic semiconductor packaging market is competitive, but there remains a gap in advanced packaging technologies compared to international standards, with traditional packaging types still dominating the market [6]. - The project focuses on high-reliability packaging products such as DFN, LGA, and BGA, which are in high demand across various sectors including robotics, AI servers, and automotive [7]. Government Support - The local government has provided robust support for the project, facilitating a streamlined process for company registration, project filing, and financing, which has bolstered investor confidence [7].