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平安银行助力科技创新债券首发 推动金融资本赋能硬科技
000001PAB(000001) 中国金融信息网· Zhong Guo Jin Rong Xin Xi Wang·2025-05-17 09:07

Group 1 - Ping An Bank successfully led the issuance of BOE Technology Group's 2025 second phase of technology innovation bonds, with a scale of 1 billion yuan and a maturity of 10 years at a coupon rate of 2.23%, receiving 3.15 times oversubscription from the market [1][3] - The funds raised will be specifically used for technology upgrades in the semiconductor display field, aligning with BOE's focus on high-generation production line construction and core technology breakthroughs [3] - The issuance is part of a broader initiative by the People's Bank of China and the China Securities Regulatory Commission to support technology innovation bonds, aiming to guide social capital towards key areas of technological innovation [1][3] Group 2 - In 2024, BOE is projected to achieve approximately 198.5 billion yuan in operating revenue, maintaining its position as the global leader in core product shipments in the semiconductor display industry [3] - The overall market for technology innovation bonds in China is expanding, with the issuance volume surpassing 1.2 trillion yuan in 2024, reflecting a year-on-year increase of 58% [3] - Ping An Bank aims to deepen its technology financial services, focusing on strategic emerging industries such as semiconductors, artificial intelligence, and biomedicine, to attract more long-term capital into the forefront of technological innovation [3]