2024年全球和中国刚性覆铜板产业销售及企业格局现状，行业进入调整期[图]

Core Viewpoint - The rigid copper-clad laminate industry in China experienced rapid growth from 2019 to 2021 due to the acceleration of 5G base station construction, surging demand for electronic components in new energy vehicles, and increased consumer electronics demand driven by the pandemic. However, starting in 2022, the industry entered an adjustment phase due to global economic recession, weak consumer electronics demand, and semiconductor supply chain disruptions. In 2023, the contraction continued, with sales volume slightly decreasing to 524.9 million square meters and sales revenue shrinking further to 9.334 billion yuan, representing a year-on-year decline of 16.3% [1][11]. Rigid Copper-Clad Laminate Industry Overview - Rigid copper-clad laminates play a crucial role in electronic circuit manufacturing, providing conductivity, insulation, and support, which significantly impact signal transmission speed, energy loss, and characteristic impedance [2]. - The industry can be categorized into single-sided, double-sided, multi-layer, rigid, and flexible copper-clad laminates, with rigid laminates primarily used in communication devices, household appliances, electronic toys, and computer peripherals [2]. Industry Policy Background - China's policy support for the rigid copper-clad laminate industry is characterized by multi-level and multi-dimensional collaborative promotion, focusing on technological upgrades, intelligent equipment transformation, and green transition [4][5]. - Key policy initiatives include supporting the research and development of high-frequency and high-speed copper-clad laminates and high-performance substrates, optimizing production processes, and establishing standardized testing systems to enhance product reliability [4]. Industry Chain - The rigid copper-clad laminate industry chain in China consists of upstream suppliers of key raw materials such as electronic-grade glass fiber cloth, copper foil, resin, and wood pulp paper; midstream production focusing on manufacturing through lamination and coating processes; and downstream applications covering communication devices, household appliances, electronic toys, and computer peripherals [7]. Current Industry Development Status - In 2023, the global rigid copper-clad laminate market faced macroeconomic fluctuations, with total sales revenue declining by 16.3% to 12.734 billion USD and sales volume slightly decreasing by 1.1% to 656.8 million square meters [9]. - The market shows significant differentiation among product categories, with conventional FR-4 maintaining a 33.38% sales revenue share, while special resin-based and dedicated CCL (including high-speed, high-frequency, and IC carrier board materials) increased to 32.88% due to resilient high-end demand driven by AI servers, 5G communication, and advanced packaging technologies [9]. Competitive Landscape - The global rigid copper-clad laminate industry exhibits a pattern of one dominant player and multiple strong competitors, with companies like Kingboard Chemical, Shengyi Technology, and Taiyo Yuden leading the mid-to-high-end market through high-frequency and high-speed substrate research and large-scale manufacturing capabilities [13]. - Chinese leading enterprises are accelerating upgrades to low dielectric loss and high thermal conductivity products, leveraging the demand from 5G base station construction, new energy vehicle systems, and AI computing hardware [13][15]. Industry Development Trends - The rigid copper-clad laminate industry in China is rapidly advancing towards high-frequency, high-speed, high-thermal conductivity, and low-loss products to meet the stringent material performance requirements of emerging fields such as 5G communication, artificial intelligence, new energy vehicles, and data centers [17]. - The industry is also transitioning towards halogen-free and low-VOC emissions products driven by environmental policies, with a focus on green production technologies and circular economy models becoming core development directions [17].