联发科首席执行官：我们与台积电关系密切，将使用其CoWoS封装技术用于人工智能专用集成电路（AI ASIC）芯片。

Core Viewpoint - Media reports indicate that MediaTek's CEO emphasized the company's close relationship with TSMC and plans to utilize TSMC's CoWoS packaging technology for artificial intelligence-specific integrated circuit (AI ASIC) chips [1] Group 1 - MediaTek is set to leverage TSMC's advanced CoWoS packaging technology for its AI ASIC chips [1] - The collaboration between MediaTek and TSMC highlights the strategic importance of partnerships in the semiconductor industry [1]