Vishay Intertechnology 80 V MOSFET in PowerPAK® 8x8SW Package Offers Best in Class RDS(ON) of 0.88 mΩ to Increase Efficiency

Space-Saving Device Offers Low Max. RthJC of 0.36 °C/W and Wettable Flanks to Improve Thermal Performance and Solderability in Industrial Applications MALVERN, Pa., May 21, 2025 (GLOBE NEWSWIRE) -- To provide higher efficiency for industrial applications, Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new 80 V TrenchFET® Gen IV n-channel power MOSFET in the PowerPAK® 8x8SW bond wireless (BWL) package with best in class on-resistance. Compared to competing devices in the same footprint, the Vish ...