央行：目前将近有100家左右机构在发行科技创新债券，金额超过2500亿

Core Viewpoint - The Chinese government is enhancing support for venture capital firms by establishing a "Technology Board" in the bond market to facilitate the issuance of technology innovation bonds, particularly targeting top-tier private equity investment institutions [1][2]. Group 1: Technology Board Initiatives - The People's Bank of China, along with other regulatory bodies, has created a differentiated bond issuance system for technology enterprises, allowing for flexible bond issuance, simplified disclosure requirements, and customized bond terms [1][2]. - The initiative includes measures such as waiving transaction fees for bond issuance and providing specialized market-making services [1][2]. Group 2: Support for Private Equity Institutions - Private equity institutions are identified as crucial players in supporting technological innovation and capital formation, but they face challenges such as short financing terms and high costs [2]. - The Technology Board aims to address these issues by creating risk-sharing tools, providing low-cost refinancing, and collaborating with local governments to mitigate default risks for bond investors [2]. Group 3: Market Response and Future Outlook - There is a positive market response, with nearly 100 institutions already involved in issuing technology innovation bonds, totaling over 250 billion [2]. - The government plans to continue monitoring and improving the support mechanisms for the Technology Board to maximize its effectiveness [2].