Group 1: Project Overview - Accelsius has been selected as a key contributor to the U.S. Department of Energy's ARPA-E COOLERCHIPS project, focusing on developing a next-generation hybrid cooling architecture for data centers [1][3] - The project aims to reduce total cooling energy consumption to less than 5% of a data center's IT load while maintaining reliability and enabling high-density computing [3] Group 2: Technology and Contributions - Accelsius will provide its proprietary MR250, a multi-rack, in-row, 250kW two-phase Coolant Distribution Unit (2P CDU), for system-level testing at the UT Arlington campus [2] - The MR250 is expected to be generally available by late 2025, enhancing the project's test infrastructure [2] Group 3: Collaboration and Impact - The collaboration between Accelsius and The University of Texas at Arlington is expected to advance the understanding and benchmarking of two-phase, direct-to-chip cooling technologies [3][4] - Industry leaders express excitement about the potential impact of this collaboration on U.S. leadership in next-generation data center efficiency [4] Group 4: Company Background - Accelsius, founded by Innventure, Inc. (NASDAQ:INV), specializes in advanced cooling solutions that help data center and edge operators achieve business, financial, and sustainability goals [5] - The company's NeuCool platform offers best-in-class thermal efficiencies through a safe, two-phase liquid cooling system scalable from single racks to entire data centers [5]
Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future