智通财经网·2025-05-27 08:23Group 1 - The core viewpoint of the report is that the transition from 2D to 3D architecture in DRAM is essential due to the challenges faced in further miniaturization of DRAM processes, with hybrid bonding technology representing the future path for 3D DRAM [1] - The report highlights that the current bottleneck in AI edge inference speed is memory bandwidth rather than computing power, and that 3D DRAM can significantly enhance transmission efficiency [1][3] - The use of NPU as a co-processor combined with 3D DRAM is likely to be the next trend in edge technology, with companies like Zhaoyi Innovation (兆易创新) being recommended for investment [1][2] Group 2 - AI applications are diversifying rather than conforming to a unified model, with new hardware technologies being developed to support this trend, particularly through the use of smaller models that outperform larger ones [2] - The report indicates that the memory bandwidth limitation is significantly greater than the computational limitation, as demonstrated by the Snapdragon 8 GEN3 example, where memory bandwidth constraints are evident [3] - Major players in the industry, including Zhaoyi Innovation and its subsidiaries, as well as Taiwanese storage IDM Winbond and Qualcomm, are focusing on the 3D DRAM and NPU solution, indicating a clear technological trend [3]