Jin Rong Shi Bao·2025-05-28 01:46Group 1 - The core viewpoint of the news is that the launch of the "Technology Board" in the bond market has led to a significant increase in the issuance of technology innovation bonds (科创债), with banks becoming the main issuers, reflecting a trend of financial resources being directed towards technological innovation [1][4]. - As of May 25, 14 banks have collectively issued 170 billion yuan in technology innovation bonds, accounting for approximately 60% of the total issuance, indicating strong participation from the banking sector [1][2]. - The issuance of technology innovation bonds is supported by policies from the People's Bank of China and the China Securities Regulatory Commission, which aim to enhance the product system and support mechanisms for these bonds [4][5]. Group 2 - Major banks such as China Bank and Shanghai Bank have successfully issued technology innovation bonds with significant demand, showcasing the market's enthusiasm for these financial instruments [2][6]. - The collaboration between banks and securities firms is highlighted, as they work together to support technological innovation, forming a core force in the financial ecosystem [2][4]. - The expected growth in the technology innovation bond market is driven by ongoing policy support and market momentum, with projections indicating a potential explosive increase in issuance this year [6].