Workflow
2025年中国激光直接成型(LDS)塑料市场规模及趋势分析:激光直接成型(LDS)塑料应用前景广阔,需求量巨大[图]
Chan Ye Xin Xi Wang·2025-05-29 06:50

Core Viewpoint - The market for Laser Direct Structuring (LDS) plastics is experiencing significant growth driven by advancements in 5G communication, smart wearable devices, and automotive electronics, with the market size in China projected to reach 3.754 billion yuan by 2024 [1][6]. Group 1: Overview of LDS Plastics - Laser Direct Structuring (LDS) plastics are modified thermoplastics containing organic metal composites that release metal particles upon laser exposure, enabling the creation of conductive circuits [2]. - The common resin substrates for LDS plastics include polycarbonate (PC) and PC/ABS alloy, each with distinct advantages and disadvantages [3]. Group 2: Current Industry Development - The demand for LDS plastics in China is expected to grow to 137,500 tons in 2024, reflecting a year-on-year increase of 16.03% [5]. - The market is currently dominated by international brands like Mitsubishi Engineering Plastics and Sabic, but domestic brands such as Guangdong Zhongsu are gaining market share [5]. - The production of LDS plastics in China is projected to reach 47,600 tons in 2024, marking a year-on-year growth of 23.25% [5]. Group 3: Market Share Analysis - Leading companies in the Chinese LDS plastics market include Zhongsu Co. and Hualixing, with Zhongsu's revenue from LDS plastics expected to reach 596 million yuan in 2024, capturing a market share of 15.88% [9]. Group 4: Future Market Outlook - The LDS plastics market is anticipated to continue growing, with projections indicating a market size of 6.991 billion yuan by 2031, reflecting a compound annual growth rate (CAGR) of 8.92% from 2025 to 2031 [11]. - National policies are providing strong support for the development of new materials, positioning LDS plastics as a key component in the electronics manufacturing sector [11]. Group 5: Technological Development Trends - The development of LDS plastics is focused on enhancing dielectric performance, mechanical processing capabilities, exploring new application areas, and promoting environmental sustainability [13]. - Research is being directed towards optimizing dielectric properties to address 5G signal attenuation, improving mechanical properties for high-temperature applications, and integrating with emerging technologies like 3D printing [13].