群创投入FOPLP技术 洪进扬：今年一定会有具体成果

Core Viewpoint - The ongoing AI boom is driving advancements in semiconductor packaging technologies, particularly Fan-out Panel Level Packaging (FOPLP), which is expected to enhance chip efficiency and market competitiveness [1][2]. Group 1: Advanced Packaging Technologies - Advanced packaging integrates different chips to improve performance, reduce space, and lower power consumption, with TSMC's CoWoS technology being a notable example [1]. - FOPLP technology utilizes square substrates for IC packaging, significantly increasing usable area compared to traditional round wafers, achieving a utilization rate of 95% [1]. - The development of mid-to-high-end semiconductor packaging using 3.5 generation FOPLP glass substrates can provide an area seven times larger than that of a 12-inch glass wafer [1]. Group 2: Industry Collaboration and Development - The Ministry of Economic Affairs, in collaboration with companies like Innolux and the Industrial Technology Research Institute, has launched initiatives to promote FOPLP technology and enhance the value of existing panel production lines [1][2]. - Despite challenges in production technology, such as panel warping and yield issues, ongoing collaboration aims to reduce defects and improve manufacturing processes [2]. Group 3: Market Position and Strategy - Innolux is not competing directly with established semiconductor manufacturers but is leveraging its existing panel production capabilities to transition into advanced packaging [2][3]. - The company plans to utilize its larger glass substrates to meet the increasing demand for IC packaging, with a focus on chip-first solutions to gain market recognition [3]. - The company is committed to continuous improvement in technology and talent development in the FOPLP sector, with expectations for tangible results and shipments this year [3]. Group 4: Future Prospects and Innovations - The company is exploring various advanced technologies, including chip last and redistribution layer (RDL) techniques, while maintaining a focus on validating these technologies rather than solely on mass production [4].