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绿通科技: 关于签署收购意向协议的公告

Overview of the Acquisition - The company intends to acquire at least 51% of Jiangsu Damo Semiconductor Technology Co., Ltd. through a cash transaction, aiming to gain control over the target company [1][2] - The acquisition is currently in the planning stage and is subject to further negotiation and implementation, with uncertainties regarding the final agreement [1][2] Transaction Details - The acquisition agreement has been signed with multiple parties, including individual shareholders and limited partnerships, indicating a structured approach to the transaction [1][4] - The target company specializes in integrated circuit and semiconductor wafer measurement, providing comprehensive solutions for global clients [3][4] Target Company Information - The target company focuses on the development and sales of front-end measurement and repair equipment, primarily for 6 to 12-inch wafer production lines, supporting advanced chip manufacturing processes [4][10] - The company has established a strong market position in the semiconductor measurement equipment sector and is recognized by major clients such as SMIC and TSMC [10] Strategic Implications - Successful completion of the acquisition is expected to facilitate the company's strategic transformation towards the semiconductor sector, enhancing its business diversification and profitability [10] - The acquisition aligns with national industrial policies and the company's long-term development goals, potentially improving overall competitiveness [10] Due Diligence and Conditions - The company will conduct thorough due diligence, including financial, legal, and operational assessments, to ensure the viability of the acquisition [5][6] - A confidentiality agreement is in place to protect sensitive information related to the transaction [7] Future Steps - The company will adhere to regulatory requirements and disclose necessary information as the acquisition progresses [11] - The final terms of the acquisition will be determined based on the results of due diligence and further negotiations [6][10]